We investigate controlled phase separation of a binary Bose-Einstein condensate (BEC) in the proximity of mixed-spin-channel Feshbach resonance in the |F = 1, mF = +1 and |F = 2, mF = −1 states of 87 Rb at a magnetic field of 9.10 G. Phase separation occurs on the lower magnetic-field side of the Feshbach resonance while the two components overlap on the higher magnetic-field side. The Feshbach resonance curve of the scattering length is obtained from the shape of the atomic cloud by comparison with the numerical analysis of coupled Gross-Pitaevskii equations.

Aortic repair, if performed immediately from the onset of symptoms, showed satisfactory recovery of consciousness and neurological function in patients with AADA complicated by coma. In this patient population, immediate aortic repair is warranted.

Under the investigation of the mechanism of chemiluminescence which occurred when lophine (2, 4, 5-triphenyl-imidazole) was oxidized in an ethanol solution of potassium hydroxide with an oxidizing agent, there was isolated a new phototropic substance which was considerd to be an imidazole derivative. To the solution of lophine (1 g.) in a solution of potassium hydroxide (12g.) in ethanol (100 cc.), 450 cc. of 1% potassium ferricyanide aqueous solution was added during a period of 1.5 hr. with stirring by a stream of oxygen at room temperature. The violet color of the solution, which initially appeared, gradually disappeared and white precipitates, having a tinge of pale violet, separated out. When the oxidation was carried out in a dark place, a weak greenish blue chemiluminescence was observed. The precipitates were filtered and then washed with water repeatedly until the washing showed no reaction of ferricyanide ion.The precipitates, dried in vacuo (0.9g.) were dissolved in benzene to yield a deep red violet solution.When the solution was concentrated under reduced pressure, a lemon yellow crystalline substance separated out. It was recrystallized from ethanol as lemon yellow

We studied spin-dependent two-body inelastic collisions in F=2 87Rb Bose-Einstein condensates both experimentally and theoretically. The 87Rb condensates were confined in an optical trap and selectively prepared in various spin states in the F=2 manifold at a magnetic field of 3.0 G. Measured atom loss rates are found to depend on spin states of colliding atoms. We measured two fundamental loss coefficients for two-body inelastic collisions with the total spin of 0 and 2; the coefficients determine loss rates for all the spin pairs. The experimental results for mixtures of all the spin combinations are in good agreement with numerical solutions of the Gross-Pitaevskii equations that include the effect of a magnetic field gradient.Comment: 7 pages, 5 figure

High-speed copper electrodeposition is needed to optimize the TSV process with a high throughput. To inhibit electrodeposition on the top surface of the TSV, the ODT was microcontact-printed on the top surface. The ODT microcontact-printing effectively inhibits the copper electrodepositon on the top surface. With 1.0 ppm SDDACC, V-shapes were formed in the via cross sections and these shapes lead to bottom-up via filling. 9 Without microcontact-printing, and with 1.5 ppm SDDACC, V-shapes were again formed in the via cross sections and these shapes lead to bottom-up via filling. We succeeded in filling 10 μm diameter and 70 μm deep vias within 35 minutes without microcontact-printing. This was achieved by optimizing the SDDACC concentration with CVS measurements. The inhibition layer of the microcontact-printing does not speed up the TSV electrodeposition. The most important factor to speed up the TSV electrodeposition is optimization of the additives.Three-dimensional(3D) chip stacking produces for a high-density packaging and high-speed performance. A high-aspect ratio through silicon via(TSV) allows short interconnects and reduced signal delays. Copper has been selected as the through silicon via because of its compatibility with conventional multilayer interconnections in large scale integration (LSI) and back end processes.Copper electrodeposition in a high-aspect ratio via is one of the key technologies for 3D packaging. This electrodeposition involves almost 40% of the total TSV cost. 1 Voids or seams formed in the vias may cause serious problems in reliability.RIE and TiN barrier layer formation and copper seed layer formation require about 10 minutes according to ASET. 2 With a highspeed slurry, the CMP time can also be reduced to about 10 minutes. K.Takahashi 3 estimated the process cost of their 3D packaging. Copper electrodeposition requires several hours 4, 5 and would be the rate determining step, therefore, a reduction in the electrodeposition time is required. O.Lun 6 recently demonstrated that a Ta layer inhibits the top surface of the TSV. They used conventional additives of polyethylene glycol, bis(3-sulfopropyl) disulfide and Janus Green B and a small via of 5 μm diameter and 25 μm was filled with 15 minutes. H.Kadota 7 reported the texture and grain size of the TSV and a 10 μm diameter and 70 μm via was filled within 60 minutes using a pulse current wave form. Unfortunately, the additives they used were not described. W-P Dow 8 through mask and through hall electrodeposit the larger size via. With through mask electrodeposition, a 50 μm diameter and 390 μm via was filled with 12 hours. With the through hall electrodeposition, a 60 μm diameter and 320 μm via was filled with 9 hours.