This communication describes a possible path for transition from a wearable computer to a fiber computer in which digital processing power is integrated directly into textiles via circuits on individual fibers. Three different classes of computing fiber substrate (active, passive, and intermediate) are discussed and some technologies for their manufacture are reviewed. It is shown here that with two of these techniques it is possible to develop new substrates for the semiconductor industry. Using an silicon‐on‐insulator (SOI) process, polycrystalline silicon fibers with a length of 42 mm have been successfully produced at NMRC in Ireland. These fibers are 35 μm wide and 1 μm thick. Silicon carbide (SiC) and silicon dioxide (SiO2) endless fibers (subsequently cut in to 20 cm lengths) have also been produced by extrusion. After sintering, this method yielded polycrystalline SiC fibers and pure amorphous SiO2 glass fibers. For many future applications, fiber computing appears to be a possible key to success. The computing power offered by such fibers may be combined with additional in‐ and output functions by weaving fiber‐based sensors and piezoelectric materials into textiles.
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