Silicon Fibre Technology Development for Wearable and Ambient Electronics Applications

Healy, T. S.; DONNELLY, JULIE; O'NEILL, BRENDAN; ALDERMAN, JOHN; Mathewson, A.

doi:10.1142/9789812773081_0046

Cited by 2 publications

(2 citation statements)

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“…The experimentally measured diffusion coefficient of 0.9 × 10 Figure 7. This variation has already been reported for moisture desorption in polyimides that suffered the use of SF 6 during O 2 plasma etching [17], as is the case for our dielectric layer during the silicon underetching step [10]. The measured diffusion coefficient is significantly greater than the measured absorption coefficient.…”

Section: Humidity Sensorsupporting

confidence: 70%

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Development of a Microelectromechanical System (MEMS)-Based Multisensor Platform for Environmental Monitoring

et al. 2011

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Recent progress in data processing, communications and electronics miniaturization is now enabling the development of low-cost wireless sensor networks (WSN), which consist of spatially distributed autonomous sensor modules that collaborate to monitor real-time environmental conditions unobtrusively and with appropriate levels of spatial and temporal granularity. Recent and future applications of this technology range from preventative maintenance and quality control to environmental modelling and failure analysis. In order to fabricate these low-cost, low-power reliable monitoring platforms, it is necessary to improve the level of sensor integration available today. This paper outlines the microfabrication and characterization results of a multifunctional multisensor unit. An existing fabrication process for Complementary Metal Oxide Semiconductor CMOS-compatible microelectromechanical systems (MEMS) structures has been modified and extended to manufacture temperature, relative humidity, corrosion, gas thermal conductivity, and gas flow velocity sensors on a single silicon substrate. A dedicated signal conditioning circuit layer has been built around this MEMS multisensor die for integration on an existing low-power WSN module. The final unit enables accurate readings and cross-sensitivity compensation thanks to a combination of simultaneous readings from multiple sensors. Real-time communication to the outside world is ensured via OPEN ACCESSMicromachines 2011, 2 411 radio-frequency protocols, and data collection in a serial memory is also made possible for diagnostics applications.

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Section: Humidity Sensorsupporting

confidence: 70%

“…This patterned stack then acts as a hard mask for a subsequent isotropic etch of the bulk silicon [10], as presented in Figure 3. The vertical etch depth is approximately 160 µm.…”

Section: Silicon Underetchingmentioning

confidence: 99%