Seventh IEEE International Symposium on Wearable Computers, 2003. Proceedings.
DOI: 10.1109/iswc.2003.1241413
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Technology development for building flexible silicon functional fibres

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Cited by 2 publications
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“… Soldering: based on lead‐free solders (alloys of tin, silver, copper, antimony, bismuth). Mechanical connections: embroidery of conductive yarn. Metallic snap fasteners or metalized hook‐and‐loop fasteners are used for detachable connections. Conductive adhesives that contain metallic particles (typically silver) or carbon black dispersed in monomers or polymers (e.g., [poly]urethane) or bicomponent epoxy resins (Healy et al 2003; Kolbe et al 2005). …”
Section: Description Of E‐textilesmentioning
confidence: 99%
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“… Soldering: based on lead‐free solders (alloys of tin, silver, copper, antimony, bismuth). Mechanical connections: embroidery of conductive yarn. Metallic snap fasteners or metalized hook‐and‐loop fasteners are used for detachable connections. Conductive adhesives that contain metallic particles (typically silver) or carbon black dispersed in monomers or polymers (e.g., [poly]urethane) or bicomponent epoxy resins (Healy et al 2003; Kolbe et al 2005). …”
Section: Description Of E‐textilesmentioning
confidence: 99%
“…Conductive adhesives that contain metallic particles (typically silver) or carbon black dispersed in monomers or polymers (e.g., [poly]urethane) or bicomponent epoxy resins (Healy et al 2003; Kolbe et al 2005).…”
Section: Description Of E‐textilesmentioning
confidence: 99%