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The achievement of high-quality continuous polycrystalline silicon (poly-Si) layers onto glass substrates by using aluminum-induced crystallization is reported. The crystallization behavior of dc sputtered amorphous silicon on glass induced by an Al interface layer has been investigated above and below the eutectic temperature of 577 °C. Secondary electron micrographs in combination with energy-dispersive x-ray microanalysis show that annealing below this temperature leads to the juxtaposed Al and Si layers exchanging places. The newly formed poly-Si layer is fully crystallized and of good crystalline quality, according to Raman spectroscopy and transmission electron microscopy investigations. At 500 °C, the time needed to crystallize a 500-nm-thick Si layer is as short as 30 min. By annealing above the eutectic temperatures, layer exchange is not as pronounced and the newly formed Al layer is found to contain a network of crystallized Si.

A method for spatially resolved measurement of the minority carrier diffusion length in silicon wafers and in silicon solar cells is introduced. The method, which is based on measuring the ratio of two luminescence images taken with two different spectral filters, is applicable, in principle, to both photoluminescence and electroluminescence measurements and is demonstrated experimentally by electroluminescence measurements on a multicrystalline silicon solar cell. Good agreement is observed with the diffusion length distribution obtained from a spectrally resolved light beam induced current map. In contrast to the determination of diffusion lengths from one single luminescence image, the method proposed here gives absolute values of the diffusion length and, in comparison, it is much less sensitive to lateral voltage variations across the cell area as caused by local variations of the series resistance. It is also shown that measuring the ratio of two luminescence images allows distinguishing shunts or surface defects from bulk defects