An energetic vacuum deposition system has been used to study deposition energy effects on the properties of niobium thin films on copper and sapphire substrates. The absence of a working gas avoids the gaseous inclusions commonly seen with sputtering deposition. A biased substrate holder controls the deposition energy. Transition temperature and residual resistivity ratio of the niobium thin films at several deposition energies are obtained together with surface morphology and crystal orientation measurements by atomic force microscope inspection, X-ray diffraction analysis and transmitted electron microscope (TEM) analysis. The results show that niobium thin films on a sapphire substrate exhibit the best cryogenic properties at a deposition energy of around 123 eV. The TEM analysis revealed that epitaxial growth of film was evident when the deposition energy reached 163 eV for a sapphire substrate. Similarly, niobium thin films on copper substrates show that the film grows more oriented with higher deposition energy and the grain size reaches the scale of the film thickness at a deposition energy of around 153 eV. D
A plasma opening switch (POS) requires the use of a source to inject plasma, usually into the vac~um s~ction of a transmission line of a pulsed power generator. The injection point is typICally Just upstream of the generator load. A flash board, which consists of a network of flash~ver gaps built ~nto a strip line geometry, is capable of providing the drifting plasma source used 10 the POS. ThIS paper details a series of measurements aimed at optimizing this source plasma in order to obtain improved performance of the combination POS-load system. / Storage Inductor SWiICh#!R S ~ FIG. I. Simplified POS circuit.Load 2652 J.
The diffusivities of Sn, Mo, Zr, and Hf in liquid Ti were determined by pulsed ion-beam melting of thin liquid layers. Time-resolved optical reflectance and one-dimensional heat-flow simulations were employed to determine the melt duration. The broadening of nearly Gaussian solute concentration-depth profiles was determined ex situ using Rutherford backscattering spectrometry. Solute diffusivities in the range of 5 to 9 x 10 -5 cm 2 /s were determined at temperatures in the range of 2200 to 2500 K. Calculations of buoyancy and Marangoni convection indicate that convective contamination is unlikely.
The emerging capability to produce high average power (10-300 kW) pulsed ion beams at 0. Deposition of the energy in a thin surface layer allows melting of the layer with relatively small energies (1-10 J/cm2) and allows rapid cooling ofthe melted layer by thermal conduction into the underlying substrate. Typical cooling rates of this process (109 Wsec) are sufficient to cause amorphous layer formation and the production of non-equilibrium microstructures (nanocrystalline and metastable phases). Results fiom initial experiments confirm surface hardening, amorphous layer and nanocrystaline grain size formation, corrosion resistance in stainless steel and aluminum, metal surface polishing, controlled melt of ceramic surfaces, and surface cleaning and oxide layer removal as well as surface ablation and redeposition. These results follow other encouraging results obtained previously in Russia using single pulse ion beam systems.Potential commercialization of this surface treatment capability is made possible by the combination of two new technologies, a new repetitive high energy pulsed power capability (0.2-2MV, 25-50 kA, 60 ns, 120 Hz) developed at SNL, and a new repetitive ion beam system developed at Cornell University.
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