This paper presents a survey of corrosion potentials, pitting potentials, and electrochemical characteristics for intermetallic particles commonly present in high-strength aluminum-based alloys. Results from relevant pure metals and solid solutions are also presented. It is seen that corrosion potentials and pitting potentials vary over a wide range for various intermetallics. Elaboration of the results reveals that the electrochemical behavior of intermetallics is more detailed than the simple noble or active classification based upon corrosion potential or estimated from the intermetallic composition. Intermetallics capable of sustaining the largest cathodic current densities are not necessarily those with the most noble E corr , similarly those with the least noble E corr will not necessarily sustain the largest anodic currents. The data herein was collected via the use of a microcapillary electrochemical cell facilitating electrode investigations upon intermetallic particles in the micrometer-squared range. This survey may be used as a tool for clarification of localized corrosion phenomena in Al alloys.

Second-phase particles in A1-4.4Cu-l5Mg-0.6 Mn (2024-T3) were characterized by size and chemistry using scanning electron microscopy and associated electron-beam microanalysis methods. It was found that approximately 60% of particles greater than about 0.5 to 0.7 p.m were Al,CuMg (the S phase). This fraction corresponded to 2.7% of the total surface area. S phase particles appeared to be active with respect to the matrix phase, consistent with open-circuit potentials reported in the literature for Al,CuMg. The compound exhibited severe dealloying which resulted in the formation of Cu-rich particle remnants. Some particle remnants remained largely intact and induced pitting at their periphery once ennobled by dealloying. Other particle remnants decomposed into 10 to 100 nm Cu clusters that became detached from the alloy surface and were dispersed by mechanical action of growing corrosion product or solution movement. This observation suggests that nonfaradaic liberation of Cu from corroding 2024-T3 surfaces is possible, and provides one plausible explanation for how Cu can be redistributed across the surface by a pitting process which occurs at potentials that are hundreds of millivolts negative of the reduction potential for Cu. InfroductionHeterogeneous microstructures are intentionally developed in commercial aluminum alloys to optimize mechanical properties. Microstructural heterogeneity also arises due to impurities that are unavoidably introduced during melt processing. Unfortunately, such microstructures make Al alloys susceptible to localized corrosion during service and complicate aqueous surface finishing processes.

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