The interfacial characteristics and band alignments of high-k ZrO2 on p-GaAs have been investigated by using x-ray photoelectron spectroscopy and electrical measurements. It has been demonstrated that the presence of Si interfacial passivation layer (IPL) improves GaAs metal-oxide-semiconductor device characteristics such as interface state density, accumulation capacitance, and hysteresis. It is also found that Si IPL can reduce interfacial GaAs-oxide formation and increases effective valence-band offset at ZrO2∕p-GaAs interface. The effective valence-band offsets of ZrO2∕p-GaAs and ZrO2∕Si∕p-GaAs interfaces are determined to be 2.7 and 2.84eV, while the effective conduction-band offsets are found to be 1.67 and 1.53eV, respectively.
Structural and electrical characteristics of sputtered TiO2 gate dielectric on p-GaAs substrates have been investigated. It has been demonstrated that the introduction of thin aluminum oxynitride (AlON) layer between TiO2 and p-GaAs improves the interface quality. X-ray photoelectron spectroscopy and transmission electron microscopy results show that the AlON layer effectively suppresses the interfacial oxide formation during thermal treatment. The effective dielectric constant value is 1.5 times higher for the TiO2∕AlON gate stack compared to directly deposited TiO2 on p-GaAs substrates, with a comparable interface state density. The capacitance-voltage (C-V), current-voltage (I-V) characteristics, and charge trapping behavior of the TiO2∕AlON gate stack under constant voltage stressing exhibit an excellent interface quality and high dielectric reliability, making the films suitable for GaAs based complementary metal-oxide-semiconductor technology.
Interfacial reaction and the energy-band alignments of HfO2 films on p-GaAs substrate were investigated by using x-ray photoelectron spectroscopy and high-resolution transmission electron microscopy. It has been demonstrated that the alloying of HfO2 with Al2O3 (HfAlO) can significantly reduce native oxides formation and increases the valence-band offsets (VBOs) at HfO2∕p-GaAs interface. In addition, the effects of Si interfacial passivation layer on band alignments have also been studied. VBO at HfO2∕p-GaAs, HfAlO∕p-GaAs, and HfO2∕Si∕p-GaAs interfaces were 2.85, 2.98, and 3.07eV, respectively.
We successfully synthesized high quality single crystal Si nanowires using Al catalyst via vapor-liquid-solid (VLS) mechanism, having diameters ranging from 10 to 200 nm with 10∽20 § of length. Characterization of physical and chemical properties of Al-catalyzed Si nanowires using transmission electron microscope (TEM), scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS) analysis showed that single crystal Si nanowires can be grown with Al-catalyst at 540 ¡C and selective etching of Al existing at the tip of nanowire can provide metal-free Si nanowires that are compatible with conventional Si-based IC process. By using plasma doping method, it was confirmed that the doping level can be controlled and the boron was successfully introduced on Si substrate with 3×1022/cm3 of peak doping concentration.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
hi@scite.ai
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.