An experimental study was made on the effect of aluminum content on the tribological behavior of a Cu-Fe-C based friction material sliding against FC30 cast iron. As a result, the densities of all Cu-Fe-C materials decreased after sintering. In general, when Al content increased, the density decreased. Sintered 65.5mass%Cu-11.4mass%Fe-6.6mass%C based friction material (A0) had much lower hardness than 57.7mass%Cu-12.6mass%Fe-7.3mass%C and 48.1mass%Cu-14.0mass%Fe-8.0mass%C based friction materials (A10 and A20). During sintering in air, large amounts of oxides formed. The presence of Al caused Cu-Sn to decompose, Al-Cu and Fe-Sn phases to form, Cu to be oxidized, and Fe 2 O 3 to be reduced. A10 demonstrated the highest and most stable friction coefficient, as well as the smallest weight loss among three materials. Both film type and particulate type debris morphologies were observed on worn surfaces of Cu-Fe-C specimens. Local delamination of debris film was frequently observed on A0 and A20 surfaces, but seldom observed on A10 surface. Significant amounts of iron transfers from FC30 to A10 and A20 during sliding, but less such transfer occurred in A0.
Articles you may be interested inCombined helium ion beam and nanoimprint lithography attains 4 nm half-pitch dense patterns J. Vac. Sci. Technol. B 30, 06F304 (2012); 10.1116/1.4758768 45 nm hp line/space patterning into a thin spin coat film by UV nanoimprint based on condensationThe effects of process parameters on pattern embossing into hydrogen silsesquioxane films and the pattern degradation of hydrogen silsesquioxane were investigated. Methylisobutylketone ͑MIBK͒ was used to dilute hydrogen silsesquioxane, and NX-1000 ͑Nanonex͒ was used to imprint hydrogen silsesquioxane embossed with a Si grating mold at 25°-180°C under 2 -2.5 MPa. The imprint results were observed by scanning electron microscopy and correlated to the analysis results of Fourier transform infrared spectroscopy ͑FTIR͒ and nanoindentation. The FTIR results show that network-type bonding was promoted by dilution with MIBK and increasing baking temperatures from 50°C to 180°C. High-temperature thermal-cycle heat treatment can promote the formation of network bonds, which make hydrogen silsesquioxane film undergo plastic deformation more easily. In contrast, low-temperature thermal-cycle heat treatment can result in hydrogen silsesquioxane having a highly viscous response and high time-dependent deformation behavior. The diluted hydrogen silsesquioxane film under prebaking at 150°C for 3 min and imprinting at 180°C for 2 min under 2.5 MPa resulted in a high-fidelity pattern replication without pattern degradation after aging at room temperature for 20 days.
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