Ferroelectricity in crystalline hafnium oxide thin films is strongly investigated for the application in non-volatile memories, sensors and other applications. Especially for back-end-of-line (BEoL) integration the decrease of crystallization temperature is of major importance. However, an alternative method for inducing ferroelectricity in amorphous or semi-crystalline hafnium zirconium oxide films is presented here, using the newly discovered effect of electric field-induced crystallization in hafnium oxide films. When applying this method, an outstanding remanent polarization value of 2P$$_{\mathrm{R}}$$
R
= 47 $$\upmu$$
μ
C/cm$$^{2}$$
2
is achieved for a 5 nm thin film. Besides the influence of Zr content on the film crystallinity, the reliability of films crystallized with this effect is explored, highlighting the controlled crystallization, excellent endurance and long-term retention.
This article reports a novel ferroelectric fieldeffect transistor (FeFET)-based crossbar array cascaded with an external resistor. The external resistor is shunted with the column of the FeFET array, as a current limiter and reduces the impact of variations in drain current (I d ), especially in a low threshold voltage (LVT) state. We have designed crossbar arrays of 8 × 8 sizes and performed multiply-and-accumulate (MAC) operations. Furthermore, we have evaluated the performance of the current limited FeFET crossbar array in system-level applications. Finally, the system-level performance evaluation was done by neuromorphic simulation of the resistor-shunted FeFET crossbar array. The crossbar array achieved software-comparable inference accuracy (∼97%) for National Institute of Standards and Technology (MNIST) datasets with multilayer perceptron (MLP) neural network, whereas the crossbar arrays built solely with FeFETs failed to learn, yielding only 9.8% accuracy.
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