Thermal reliability of the solder sealing ring of Agilent Technologies’ bubble-actuated photonic cross-connect switches has been investigated in this paper. Emphasis is placed on the determination of the thermal-fatigue life of the solder sealing ring under shipping/storing/handling conditions. The solder ring is assumed to obey the Garofalo-Arrhenius creep constitutive law. The nonlinear responses such as the deflections, stresses, creep strains, and creep strain energy density of the 3-D photonic package have been determined with a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal-fatigue life of the solder sealing ring is readily determined and is found to be more than adequate for shipping/storing/handling the photonic switches.
Micro/nano engineering is an emerging field which enables engineering and scientific discoveries in the microworld. As an effective and powerful tool for automation and manipulation at small scales, precision motion measurement by computer micro-vision is now broadly accepted and widely used in micro/nano engineering. Unlike other measurement methods, the vision-based techniques can intuitively visualize the measuring process with high interactivity, expansibility, and flexibility. This review paper aims to comprehensively present a survey of micro-vision-based motion measurement from the collective experience. Working principles of micro-vision systems are firstly introduced and described, where the hardware configuration, model calibration, and motion measurement algorithms are systematically summarized. The characteristics and performances of different micro-vision-based methods are then analyzed and discussed in terms of measurement resolution, range, degree of freedom, efficiency, and error sources. Recent advances of applications empowered by the developed computer micro-visionbased methods are also presented. The review can be helpful to researchers who engage in the development of micro-vision-based techniques, as well as provide the recent state and tendency for the research community of vision-based measurement, manipulation, and automation at micro/nano scales.
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