In this study, an application of the two-dimensional imaging technology to the X ray tri-axial stress analysis was studied. An image plate (IP) was used to obtain a Debye-Scherre ring and the image data was analized for determining stress. A new principle for stress analysis which is suitable to two-dimensional imaging data was used. For the verification of this two-dimensional imaging type X-ray stress measurement method, an experiment was conducted using a ferritic steel sample which was processed with a surface grinder. Tri-axial stress analysis was conducted to evaluate the sample. The conventional method for X-ray tri-axial stress analysis proposed by Dölle and Hauk was used to evaluate residual stress in order to compare with the present method. As a result, it was confirmed that a sufficiently highly precise and high-speed stress measurement was enabled with the two-dimensional imaging technology compared with the conventional method.

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Abstract. The purpose of this study is to examine the effect of crystallite preferred orientation on the mechanical strength of TiCN thin films in highly compressive residual stress. TiCN thin films were deposited by PVD on JIS-SKH55 (AISI M35) steel. The applied substrate bias voltages were set for -50, -80, -100, -120 and -150V. Subsequently, residual stress and crystalline preferred orientation of these specimens were investigated by X-ray diffraction methodology. The crystalline preferred orientation in thin films was evaluated by the ODF calculated from pole figures. On the other hand, dynamic hardness test (DH) and scratch test were executed to evaluate the mechanical strength of thin films. In our study, it was observed that negative bias voltages had an effect on the preferred orientation. The orientation density at -120V was the highest of all specimens. In addition, the value of scratch section area at -120V was the largest of all specimens. As a conclusion, the relation between the scratch area and the negative bias voltages corresponded to the relation between the preferred orientation and the bias voltages.

Abstract. The purpose of this study is to examine the effect of crystallite preferred orientation on the mechanical strength of TiCN thin films in highly compressive residual stress. TiCN thin films were deposited by PVD on JIS-SKH55 (AISI M35) steel. The applied substrate bias voltages were set for -50, -80, -100, -120 and -150V. Subsequently, residual stress and crystalline preferred orientation of these specimens were investigated by X-ray diffraction methodology. The crystalline preferred orientation in thin films was evaluated by the ODF calculated from pole figures. On the other hand, dynamic hardness test (DH) and scratch test were executed to evaluate the mechanical strength of thin films. In our study, it was observed that negative bias voltages had an effect on the preferred orientation. The orientation density at -120V was the highest of all specimens. In addition, the value of scratch section area at -120V was the largest of all specimens. As a conclusion, the relation between the scratch area and the negative bias voltages corresponded to the relation between the preferred orientation and the bias voltages.

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