The heat transfer coefficients (h) between a cube and water were 239 and 303 W/m2K at 0 and 0.86 cm/s relative velocity. In 35% sucrose and 0 cm/set, h was 146 W/m*K. A model for heat lethality in cubes during continuous sterilization which used finite difference equations for heat conduction and above values of h, revealed that hold times for 6D inactivation of PA 3679 (F,=7.2 min) in an isothermal fluid at 132.2"C were 1.78 and 5.2 min for 1 and 2 cm cubes when h was 303 W/m2K and 1.23 and 4.13 min when h was 2500 or higher. When h was 239 W/mZK, hold times were 2.36 and 6.02 min for 1 and 2 cm cubes. When fluid entered the hold tube at 132.2"C and particle to fluid ratio was 0.56, fluid-particle heat exchange increased hold time to 12.2 and 119 min for 1 and 2 cm cubes.
Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 °C in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investigated. Electron probe microanalyzer (EPMA) analyses reveal that the element oxygen distributes uniformly within the solder matrix after soldering, while Ti segregates effectively at the ITO/solder and Cu/solder interfaces at such a low temperature, giving satisfactory joining results of Cu/Cu, ITO/ITO, and ITO/Cu in air.
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