Active Soldering of Indium Tin Oxide (ITO) With Cu in Air Using an Sn3.5Ag4Ti(Ce, Ga) Filler

Abstract

Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 °C in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investigated. Electron probe microanalyzer (EPMA) analyses reveal that the element oxygen distributes uniformly within the solder matrix after soldering, while Ti segregates effectively at the ITO/solder and Cu/solder interfaces at such a low temperature, giving satisfactory joining results of Cu/Cu, ITO/ITO, and ITO/Cu in air.

Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler

“…Similar enrichment was also observed in prior studies of indium tin oxide (ITO) joints. 13,14 The trace amount of cerium segregates slightly at the interface (Fig. 6c).…”

“…The melting range (liquidus and solidus) of the active filler Sn3.5Ag4Ti(Ce,Ga) was between 218°C and 229°C, as determined with differential scanning calorimetry (DSC) at a heating rate of 10°C/min under an argon atmosphere in a prior study. 13 The bulk alumina ceramic was fabricated by pressure casting and sintered at 1,600°C for 2 h after 24 h drying at 60°C. The metal for joining used in this study was commercial pure copper.…”

Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal

“…The chemical composition (wt%) of the active solder was Sn: 92.12, Ag: 3.55, Ti: 4.07, Ce: 0.12, Ga: 0.14, as analyzed. The melting range (liquidus and solidus) of this solder was between 218 and 229 • C, as analyzed by a differential scanning calorimeter at a heating rate of 10 K/min under an argon atmosphere (Chang et al, 2003b). The geometry and dimensions of the ZnS-SiO 2 and copper bond specimens subjected to shear testing are shown in Fig.…”

Study of Direct Bonding of Ceramic and Metallic Materials with Zn4Al Solder

“…A nano-crystalline α-Al 2 O 3 layer (2 nm thick) was formed in the Sn-Zn-Al/sapphire boundary during soldering in the air at a temperature of 230°C. The shear strength of joints measured 43 to 48 MPa, which is a relatively high value when compared to other Al 2 O 3 ceramic joints fabricated with active Sn solders and the addition of Ti and/or lanthanides [3,4,5].…”

“…In work [4], the following strengths were achieved by soldering: Cu/Cu (14.3MPa), ITO/ITO (6.8 MPa) and ITO/Cu (3.4 MPa). Similarly, in study [8], the attained shear strengths of joints were as follows: alumina/alumina (13.5 MPa), copper/copper (14.3 MPa) and alumina/copper (10.2 MPa).…”