This work describes a compact accelerometer, which integrates three spring-proof mass systems into a single structure to sense triaxial motion. It has a size of 1.3 × 1.28 mm 2 and an operating range of ±1 g. Silicon-on-glass (SOG) micromachining and deep reactive-ion etching (DRIE)-based process are adopted to fabricate this accelerometer with a high-aspect-ratio sensing structure. The accelerometer has an excellent z-axis output sensitivity of 1.434 V g −1 and a high resolution of 49 μg Hz −1/2 . The sensitivity and minimum cross-axis sensitivity of the x-axis in-plane accelerometer are 1.442 V g −1 and 0.03% and those of the y-axis accelerometer are 1.241 V g −1 and 0.21%, respectively. The new in-plane and out-of-plane accelerometer design exhibits high cross-axis sensitivity immunity, high sensitivity and high linearity suggesting that the triaxial accelerometer has the potential for use in future applications in consumer goods and the cellular phone market.
This paper deals with the design, fabrication and preliminary experimental characterizations of a novel integrated dual-axis tuning fork gyroscope (DTFG). The DTFG is fabricated by high-aspect-ratio silicon-on-glass (SOG) process and vacuum packaged by glass frit bonding. Furthermore, a CMOS drive/readout ASIC chip, which is fabricated by a 0.25 µm 1P5M standard CMOS process, is integrated with the fabricated DTFG by directly wire-bonding. The experimental results of DTFG demonstrate that the rate sensitivities of Z-axis and X-axis sense modes are 1.47 mV/DPS and 0.18 mV/DPS respectively and the associated R2-linearity are 0.9995 and 0.9996. The noise-floors are 0.030 DPS/ Hz 1/2 and 0.247 DPS/Hz 1/2 for Z-axis and X-axis sense modes respectively.
This paper presents a vibrating micro-resonator using transimpedance amplifier (TIA) for gyroscope applications. First, a gyroscope model is built for sensor design. The critical parameters are optimized by theoretical calculation and fine tuned by finite-elementanalysis (FEM). Then, SOG-bulk micromachining and deep reactive ion etching (DRIE) are adopted to fabricate the gyroscope with high aspect-ratio sensing structure and high yield. Finally, an ASIC, TIA with large on-chip transimpedance is developed for driving loop to accomplish a self-oscillated micro-resonator.
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