New capacitive low-<i>g</i>triaxial accelerometer with low cross-axis sensitivity

Hsu, Yu‐Wen; Chen, Jen-Yi; Chien, Hsin-Tang; Chen, Sheah; Lin, Shih-Ting; Liao, Lu-Po

doi:10.1088/0960-1317/20/5/055019

Cited by 37 publications

(21 citation statements)

References 11 publications

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“…The main benefits of these 3D-stacked approaches are their higher integration densities, shorter signal path lengths and smaller package footprints/volumes in comparison with multi-chip modules. This method enables chip-to-wafer stacking 43,44,46 and is employed both in research [47][48][49][50] and in a large number of commercial products, such as accelerometers and pressure sensors [51][52][53] .…”

Section: Memsmentioning

confidence: 99%

Integrating MEMS and ICs

et al. 2015

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The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs typically provide functionalities related to the signals of these transducers, such as analog-to-digital conversion, amplification, filtering and information processing as well as communication between the MEMS transducer and the outside world. Thus, the vast majority of commercial MEMS products, such as accelerometers, gyroscopes and micro-mirror arrays, are integrated and packaged together with ICs. There are a variety of possible methods of integrating and packaging MEMS and IC components, and the technology of choice strongly depends on the device, the field of application and the commercial requirements. In this review paper, traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed. These include approaches based on the hybrid integration of multiple chips (multi-chip solutions) as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques. These are important technological building blocks for the 'More-ThanMoore' paradigm described in the International Technology Roadmap for Semiconductors. In this paper, the various approaches are categorized in a coherent manner, their merits are discussed, and suitable application areas and implementations are critically investigated. The implications of the different MEMS and IC integration approaches for packaging, testing and final system costs are reviewed.

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Section: Memsmentioning

confidence: 99%

Integrating MEMS and ICs

et al. 2015

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“…Previous studies of micromachined capacitive accelerometers had stated some characterizations of the cross-axis sensitivity in these accelerometers, and had put forward some designs to suppress the cross-axis sensitivity [9][10][11][12][13]. However, the origin and phenomenon of the cross-axis sensitivity of an optomechanical accelerometer are pretty different from the traditional ones in terms of its specific optical readout.…”

Section: Analysis Of the Cross-axis Sensitivitymentioning

confidence: 99%

“…Cross-axis sensitivity is another significant characteristic in addition to these performances. The characterization of cross-axis sensitivity in a micromachined capacitive accelerometer has been discussed in previous literatures [8][9][10], and some approaches have been proposed to reduce the cross-axis sensitivity [9][10][11][12][13]. However, there has not been a systematic research concentrated on the cross-axis sensitivity of optomechanical accelerometers while the phenomena and mechanism differfrom traditional ones.…”

Section: Introductionmentioning

confidence: 99%

Minimizing cross-axis sensitivity in grating-based optomechanical accelerometers

Wang

Bai

et al. 2016

Opt. Express

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Cross-axis sensitivity of single-axis optomechanical accelerometers, mainly caused by the asymmetric structural design, is an essential issue primarily for high performance applications, which has not been systematically researched. This paper investigates the generating mechanism and detrimental effects of the cross-axis sensitivity of a high resoluion single-axis optomechanical accelerometer, which is composed of a grating-based cavity and an acceleration sensing chip consisting of four crab-shaped cantilevers and a proof mass. The modified design has been proposed and a prototype setup has been built based on the model of cross-axis sensitivity in optomechanical accelerometers. The characterization of the cross-axis sensitivity of a specific optomechanical accelerometer is quantitatively discussed for both mechanical and optical components by numerical simulation and theoretical analysis in this work. The analysis indicates that the cross-axis sensitivity decreases the contrast ratio of the interference signal and the acceleration sensitivity, as well as giving rise to an additional optical path difference, which would impact the accuracy of the accelerometer. The improved mechanical design is achieved by double side etching on a specific double-substrate-layer silicon-on-insulator (SOI) wafer to move the center of the proof mass to the support plane. The experimental results demonstrate that the modified design with highly symmetrical structure can suppress the cross-axis sensitivity significantly without compromising the sensitivity and resolution. The cross-axis sensitivity defined by the contrast ratio of the output signal drops to 2.19% /0.1g from 28.28%/0.1g under the premise that the acceleration sensitivity of this single-axis optomechanical accelerometer remains 1162.45V/g and the resolution remains 1.325μg.

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“…Some designs have overcome this challenge by utilizing more than one proof mass [4]. Notably, singleaxis accelerometers were demonstrated to achieve low crosssensitivity measurements, typically less than 1%, while the cross-sensitivities of multi-axis accelerometers are usually in the order of 2% or more [5][6][7][8]. This difference is inherently due to the structural design of these multi-axis accelerometers, making them sensitive in more than one axis.…”

Section: Introductionmentioning

confidence: 99%

A dual-axis bulk micromachined accelerometer with low cross-sensitivity

Alfaifi

Nabki

El-Gamal

2012

2012 19th IEEE International Conference on Electronics, Circuits, and Systems (ICECS 2012)

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This paper introduces a novel dual-axis accelerometer structure with low cross-sensitivity. Devices are designed to be fabricated in the SOIMUMPs process, followed by an in-house release step. The device measures 1 mm × 1 mm with 4 proof masses that are able to sense accelerations in the X and Y axes independently. Simulations show a sensitivity of 25 fF/g with a maximum alignment error of 1.6°. The cross-sensitivity is less than 0.5% and the nonlinearity is 3.7% across the 4 g dynamic range. The rotational motion and Z accelerations have no impact on the device X and Y readings, thanks to the particular geometry and differential nature of the device.I.

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New capacitive low-gtriaxial accelerometer with low cross-axis sensitivity

Cited by 37 publications

References 11 publications

Integrating MEMS and ICs

Integrating MEMS and ICs

Minimizing cross-axis sensitivity in grating-based optomechanical accelerometers

A dual-axis bulk micromachined accelerometer with low cross-sensitivity

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