High-resolution x-ray photoelectron spectroscopy (XPS) at 6 keV photon energy has been realized utilizing high-flux-density x rays from the third generation high-energy synchrotron radiation facility, SPring-8. The method has been applied to analysis of high-k HfO2/interlayer/Si complementary metal–oxide–semiconductor gate-dielectric structures. With the high energy resolution and high throughput of our system, chemical-state differences were observed in the Si 1s, Hf 3d, and O 1s peaks for as-deposited and annealed samples. The results revealed that a SiOxNy interlayer is more effective in controlling the interface structure than SiO2. Our results show the wide applicability of high resolution XPS with hard x rays from a synchrotron source.

We review the technology of Ge1−xSnx-related group-IV semiconductor materials for developing Si-based nanoelectronics. Ge1−xSnx-related materials provide novel engineering of the crystal growth, strain structure, and energy band alignment for realising various applications not only in electronics, but also in optoelectronics. We introduce our recent achievements in the crystal growth of Ge1−xSnx-related material thin films and the studies of the electronic properties of thin films, metals/Ge1−xSnx, and insulators/Ge1−xSnx interfaces. We also review recent studies related to the crystal growth, energy band engineering, and device applications of Ge1−xSnx-related materials, as well as the reported performances of electronic devices using Ge1−xSnx related materials.

We have investigated Sn precipitation and strain relaxation behaviors in the growth of Ge1−xSnx layers on virtual Ge substrates (v-Ge) for strain engineering of Ge. By varying misfit strain at Ge1−xSnx∕v-Ge and Ge1−ySny∕Ge1−xSnx interfaces, we found that a critical misfit strain controls the onset of Sn precipitation at a given thickness of the Ge1−xSnx layer. A compositionally step-graded method, in which the critical misfit strain is taken into account, was applied to the growth of strain-relaxed Ge1−xSnx layers on v-Ge. Postdeposition annealing at each growth step led to lateral propagation of threading dislocations preexisting in the layer and originating from v-Ge, which resulted in high degree of strain relaxation. An epitaxial Ge layer was grown on the strain-relaxed Ge1−xSnx layer and an in-plane tensile strain of 0.68% was achieved.

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Organic electroluminescence (EL) devices were fabricated using a bis(2-methyl-8-quinolinato) aluminum hydroxide complex [Al(Mq) 2 OH] as the light-emitting material. The device exhibits bright blue EL at a peak wavelength of 485 nm. A maximum luminance of about 14,000 cd/m 2 can be achieved at a driving current density of 480 mA/cm 2 . The efficiency of the device is about 4.6 cd/A. Possible mechanisms of EL blue shift of Al(Mq) 2 OH with respect to Alq 3 are discussed.

We investigated the effects of incorporation of 0%–2% tin (Sn) into amorphous germanium (Ge) on its crystallization behavior and electrical properties. Incorporation of only 0.2% Sn caused the polycrystallization temperature of Ge to lower from 450 to 430 °C, while a polycrystalline Ge1−xSnx layer with high crystallinity compared to that of polycrystalline Ge was formed by incorporation of 2% Sn. A polycrystalline Ge1−xSnx layer with a low Sn content of 2% annealed at 450 °C exhibited a Hall hole mobility as high as 130 cm2/V s at room temperature even though it possessed a small grain size of 20–30 nm. The Hall hole mobility of a poly-Ge1−xSnx layer with an Sn content of 2% was four times higher than that of a polycrystalline Ge layer and comparable to that of single-crystalline silicon.

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