2015
DOI: 10.1063/1.4926507
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High hole mobility tin-doped polycrystalline germanium layers formed on insulating substrates by low-temperature solid-phase crystallization

Abstract: We investigated the effects of incorporation of 0%–2% tin (Sn) into amorphous germanium (Ge) on its crystallization behavior and electrical properties. Incorporation of only 0.2% Sn caused the polycrystallization temperature of Ge to lower from 450 to 430 °C, while a polycrystalline Ge1−xSnx layer with high crystallinity compared to that of polycrystalline Ge was formed by incorporation of 2% Sn. A polycrystalline Ge1−xSnx layer with a low Sn content of 2% annealed at 450 °C exhibited a Hall hole mobility as h… Show more

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Cited by 68 publications
(59 citation statements)
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“…4,5 In fact, polycrystalline GeSn thin films with Sn concentrations beyond the solubility limit have been realized using this technique. [6][7][8] Polycrystalline GeSn thin films grown on an insulator are anticipated as an alternative to polycrystalline Si films, which are currently utilized as a channel material for thin film transistors (TFTs). Amorphous GeSn recrystallizes at a lower temperature than amorphous Si because of its low eutectic temperature (231.1 C); consequently, low-temperature fabrication of TFT products can be established.…”
Section: Introductionmentioning
confidence: 99%
“…4,5 In fact, polycrystalline GeSn thin films with Sn concentrations beyond the solubility limit have been realized using this technique. [6][7][8] Polycrystalline GeSn thin films grown on an insulator are anticipated as an alternative to polycrystalline Si films, which are currently utilized as a channel material for thin film transistors (TFTs). Amorphous GeSn recrystallizes at a lower temperature than amorphous Si because of its low eutectic temperature (231.1 C); consequently, low-temperature fabrication of TFT products can be established.…”
Section: Introductionmentioning
confidence: 99%
“…2(d). Since the crystallization temperature of a-Ge is generally above 400 °C, 8,9) this case, the crystallization of the top a-Ge layer at 300 °C, is likely due to the catalytic effect of Ag atoms. 33,34) Therefore, Ag diffusion into the top a-Ge layer is a possible reason why the dendrite growth, i.e., layer exchange, stopped.…”
Section: Resultsmentioning
confidence: 99%
“…[1][2][3][4] Researchers have developed the following growth techniques for poly-Ge thin films on insulators: magnetron sputtering, 4) chemical vapor deposition, 5) laser annealing, 6,7) and solid-phase crystallization (SPC). 8,9) Those poly-Ge thin films, however, consist of small grains (< 1 μm) and their carrier mobilities are limited to 140 cm 2 V -1 s -1 . 4,8,9) In addition, because vacancies in Ge act as acceptors, the poly-Ge thin films are highly p-doped (> 5 × 10 17 cm -3 ).…”
Section: Introductionmentioning
confidence: 99%
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“…As mentioned above, therefore, to take advantage of the superior properties of Ge, poly‐Ge thin films have been investigated as a low‐cost substitute for the expensive single crystalline Ge substrates for large‐area electronic and photovoltaic applications. Recently, several crystallization processes for α ‐Ge have been reported to obtain high quality poly‐Ge films such as solid phase crystallization (SPC), laser annealing, and metal‐induced crystallization (MIC) . However, crystallization of α ‐Ge with SPC process requires high annealing temperature around 500°C, which is too high for inexpensive substrates.…”
Section: Introductionmentioning
confidence: 99%