With aggressive scaling of device geometries, density of manufacturing faults is expected to increase. Therefore, yield of complex Multi-Processor Systems-on-Chips (MP-SoCs) will decrease due to higher probability of manufacturing defects especially, in dies with large area. Therefore, disintegration of large SoCs into smaller chips called chiplets will improve yield and cost of complex platform-based systems. This will also provide functional flexibility, modular scalability as well as the capability to integrate heterogeneous architectures and technologies in a single unit. However, with scaling of the number of chiplets in such a system, the shared resources in the system such as the interconnection fabric and memory modules will become performance bottlenecks. Additionally, the integration of heterogeneous chiplets operating at different frequencies and voltages can be challenging. State-of-the-art inter-chip communication requires power-hungry high-speed I/O circuits and data transfer over long wired traces on substrates. This increases energy consumption and latency while decreasing data bandwidth for chip-to-chip communication. In this paper, we explore the advances and the challenges of interconnecting a multi-chip system with millimeter-wave (mm-wave) wireless interconnects from a variety of perspectives spanning multiple aspects of the wireless interconnection design. Our discussion on the recent advances include aspects such as interconnection topology, physical layer, Medium Access Control (MAC) and routing protocols. We also present some potential paradigm-shifting applications as well as complementary technologies of wireless inter-chip communications.
Generative Adversarial Networks (GANs) have recently introduced effective methods of performing Imageto-Image translations. These models can be applied and generalized to a variety of domains in Image-to-Image translation without changing any parameters. In this paper, we survey and analyze eight Image-to-Image Generative Adversarial Networks: Pix2Px, CycleGAN, CoGAN, StarGAN, MU-NIT, StarGAN2, DA-GAN, and Self Attention GAN. Each of these models presented state-of-the-art results and introduced new techniques to build Image-to-Image GANs. In addition to a survey of the models, we also survey the 18 datasets they were trained on and the 9 metrics they were evaluated on. Finally, we present results of a controlled experiment for 6 of these models on a common set of metrics and datasets. The results were mixed and showed that on certain datasets, tasks, and metrics some models outperformed others. The last section of this paper discusses those results and establishes areas of future research. As researchers continue to innovate new Image-to-Image GANs, it is important that they gain a good understanding of the existing methods, datasets, and metrics. This paper provides a comprehensive overview and discussion to help build this foundation.
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