Multihop communication links in conventional Networks-on-Chips (NoCs) results in lower rates of data transfer and higher energy dissipation. Long-range millimeter-wave wireless interconnects were envisioned to alleviate this problem. However, the available bandwidth of the wireless channels is limited and hence an efficient media access control (MAC) scheme is required to enhance the utilization of the available bandwidth. In this article we show that with multiple simultaneous access of the shared wireless medium using a Code Division Multiple Access (CDMA) scheme the peak performance can be improved significantly while lowering energy dissipation in data transfer compared to the conventional wireline counterparts as well as state-of-the-art Wireless NoCs using similar technologies. We present a thorough analysis of the reliability in data transfer using the CDMA based wireless links and show that a reliability-aware architecture design with CDMA based wireless links can lower the energy dissipation in NoC fabrics without compromising the achievable robustness.
Wireless interconnects have emerged as an energy-efficient interconnection paradigm for multicore chips with Networks-onChips (NoCs). As wireless interconnects have the unique advantage of eliminating the need to layout physical channels they provide an inherent opportunity for dynamic reconfiguration of the NoC architecture. Large temporal and spatial variability in traffic patterns is expected in large multicore chips and especially in future heterogeneous systems-on-chips integrating different kinds of cores such as CPUs, GPUs, ASICs and memory. By establishing on-demand wireless links in response to dynamically varying traffic patterns the data bandwidth and energy efficiency of NoC architectures can be improved compared to static architectures with the same raw bandwidth. We present a dynamic medium access mechanism that establishes wireless links depending on traffic requirements while reducing the overheads. Such an interconnection system incorporating wireless links in a NoC fabric will be better suited to address non-uniformity and temporal variations in traffic patterns which are expected in future large multicore chips.
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