| In this paper, we present a brief history of silicon photonics from the early research papers in the late 1980s and early 1990s, to the potentially revolutionary technology that exists today. Given that other papers in this special issue give detailed reviews of key aspects of the technology, this paper will concentrate on the key technological milestones that were crucial in demonstrating the capability of silicon photonics as both a successful technical platform, as well as indicating the potential for commercial success. The paper encompasses discussion of the key technology areas of passive devices, modulators, detectors, light sources, and system integration.In so doing, the paper will also serve as an introduction to the other papers within this special issue.

Heterogeneous integration of III-V semiconductor materials on a silicon-on-insulator (SOI) platform has recently emerged as one of the most promising methods for the fabrication of active photonic devices in silicon photonics. For this integration, it is essential to have a reliable and robust bonding procedure, which also provides a uniform and ultra-thin bonding layer for an effective optical coupling between III-V active layers and SOI waveguides. A new process for bonding of III-V dies to processed siliconon-insulator waveguide circuits using divinylsiloxane-bis-benzocyclobutene (DVS-BCB) was developed using a commercial wafer bonder. This "cold bonding" method significantly simplifies the bonding preparation for machine-based bonding both for die and wafer-scale bonding. High-quality bonding, with ultra-thin bonding layers (<50 nm) is demonstrated, which is suitable for the fabrication of heterogeneously integrated photonic devices, specifically hybrid III-V/Si lasers. K. Mayora, "Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding," J. Micromech. Microeng. 14(7), 1047-1056 (2004

Nonlinear silicon photonic devices have attracted considerable attention thanks to their ability to show large third-order nonlinear effects at moderate power levels allowing for all-optical signal processing functionalities in miniaturized components. Although significant efforts have been made and many nonlinear optical functions have already been demonstrated in this platform, the performance of nonlinear silicon photonic devices remains fundamentally limited at the telecom wavelength region due to the two photon absorption (TPA) and related effects. In this work, we propose an alternative CMOS-compatible platform, based on silicon-rich silicon nitride that can overcome this limitation. By carefully selecting the material deposition parameters, we show that both of the device linear and nonlinear properties can be tuned in order to exhibit the desired behaviour at the selected wavelength region. A rigorous and systematic fabrication and characterization campaign of different material compositions is presented, enabling us to demonstrate TPA-free CMOS-compatible waveguides with low linear loss (~1.5 dB/cm) and enhanced Kerr nonlinear response (Re{γ} = 16 Wm−1). Thanks to these properties, our nonlinear waveguides are able to produce a π nonlinear phase shift, paving the way for the development of practical devices for future optical communication applications.

Due to its excellent electronic and photonic properties, silicon is a good candidate for mid-infrared optoelectronic devices and systems that can be used in a host of applications. In this paper we review some of the results reported recently, and we also present several new results on midinfrared photonic devices including Mach-Zehnder interferometers, multimode interference splitters and multiplexers based on silicon-oninsulator, polysilicon, suspended silicon, and slot waveguide platforms.

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Silicon photonics has been a very buoyant research field in the last several years mainly because of its potential for telecom and datacom applications. However, prospects of using silicon photonics for sensing in the mid-IR have also attracted interest lately. In this paper, we present our recent results on waveguide based devices for near-and mid-infrared applications. The silicon-on-insulator platform can be used for wavelengths up to 4μm, therefore different solutions are needed for longer wavelengths. We show results on passive Si devices such as couplers, filters and multiplexers, particularly for extended wavelength regions, and finally present integration of photonics and electronics integrated circuits for high speed applications.

Abstract-Germanium based photonic devices can play a significant role in several applications, particularly in the socalled fingerprint wavelength region. Here, we review our recent results on mid-infrared germanium photonic devices that show promising performance in the 2-7.5 µm wavelength range.