Photoluminescence ͑PL͒, Raman spectroscopy, and x-ray diffraction are employed to demonstrate the coexistence of a biaxial and a hydrostatic strain that can be present in GaN thin films. The biaxial strain originates from growth on lattice-mismatched substrates and from post-growth cooling. An additional hydrostatic strain is shown to be introduced by the presence of point defects. A consistent description of the experimental results is derived within the limits of the linear and isotropic elastic theory using a Poisson ratio ϭ0.23Ϯ0.06 and a bulk modulus Bϭ200Ϯ20 GPa. These isotropic elastic constants help to judge the validity of published anisotropic elastic constants that vary greatly. Calibration constants for strain-induced shifts of the near-bandedge PL lines with respect to the E 2 Raman mode are given for strain-free, biaxially strained, and hydrostatically contracted or expanded thin films. They allow us to extract differences between hydrostatic and biaxial stress components if present. In particular, we determine that a biaxial stress of one GPa would shift the near-band-edge PL lines by 27Ϯ2 meV and the E 2 Raman mode by 4.2Ϯ0.3 cm Ϫ1 by use of the listed isotropic elastic constants. It is expected from the analyses that stoichiometric variations in the GaN thin films together with the design of specific buffer layers can be utilized to strain engineer the material to an extent that greatly exceeds the possibilities known from other semiconductor systems because of the largely different covalent radii of the Ga and the N atom. ͓S0163-1829͑96͒03148-7͔

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Transmission electron microscopy has been applied to characterize the structure of Ti/Al and Ti/Al/Ni/Au Ohmic contacts on n-type GaN (∼1017 cm−3) epitaxial layers. The metals were deposited either by conventional electron-beam or thermal evaporation techniques, and then thermally annealed at 900 °C for 30 s in a N2 atmosphere. Before metal deposition, the GaN surface was treated by reactive ion etching. A thin polycrystalline cubic TiN layer epitaxially matched to the (0001) GaN surface was detected at the interface with the GaN substrate. This layer was studied in detail by electron diffraction and high resolution electron microscopy. The orientation relationship between the cubic TiN and the GaN was found to be: {111}TiN//{00.1}GaN, [110]TiN//[11.0]GaN, [112]TiN//[10.0]GaN. The formation of this cubic TiN layer results in an excess of N vacancies in the GaN close to the interface which is considered to be the reason for the low resistance of the contact.

Strained GaSb quantum dots having a staggered band lineup (type II) are formed in a GaAs matrix using molecular beam epitaxy. The dots are growing in a self-organized way on a GaAs(100) surface upon deposition of 1.2 nm GaSb followed by a GaAs cap layer. Plan-view transmission electron microscopy studies reveal well developed rectangular-shaped GaSb islands with a lateral extension of ∼20 nm. Intense photoluminescence (PL) is observed at an energy lower than the GaSb wetting layer luminescence. This line is attributed to radiative recombination of 0D holes located in the GaSb dots and electrons located in the surrounding regions. The GaSb quantum dot PL dominates the spectrum up to high excitation densities and up to room temperature.

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Transmission electron microscopy, x-ray diffraction, low-temperature photoluminescence, and Raman spectroscopy were applied to study stress relaxation and the dislocation structure in a Si-doped GaN layer in comparison with an undoped layer grown under the same conditions by metalorganic vapor phase epitaxy on (11.0) Al2O3. Doping of the GaN by Si to a concentration of 3×1018 cm−3 was found to improve the layer quality. It decreases dislocation density from 5×109 (undoped layer) to 7×108 cm−2 and changes the dislocation arrangement toward a more random distribution. Both samples were shown to be under biaxial compressive stress which was slightly higher in the undoped layer. The stress results in a blue shift of the emission energy and E2 phonon peaks in the photoluminescence and Raman spectra. Thermal stress was partly relaxed by bending of threading dislocations into the basal plane. This leads to the formation of a three-dimensional dislocation network and a strain gradient along the c axis of the layer.