An approach to control the interpore distances and nanopore diameters of 150-nm-thick thin aluminum films is reported here. The Al thin films were grown by sputtering on p-type silicon substrate and anodized with a conventional anodization process in a phosphoric acid solution. It was found that interpore distance and pore diameter are related to the aluminum grain size and can be controlled by annealing. The grain contours limit the sizes of alumina cells. This mechanism is valid for grain sizes supporting only one alumina cell and consequently only one pore.
Damage accumulation in neon-implanted silicon with fluences ranging from 5 ϫ 10 14 to 5 ϫ 10 16 Ne cm −2 has been studied in detail. As-implanted and annealed samples were investigated by Rutherford backscattering spectrometry under channeling conditions and by transmission electron microscopy in order to quantify and characterize the lattice damage. Wavelength dispersive spectrometry was used to obtain the relative neon content stored in the matrix. Implantation at room temperature leads to the amorphization of the silicon while a high density of nanosized bubbles is observed all along the ion distribution, forming a uniform and continuous layer for implantation temperatures higher than 250°C. Clusters of interstitial defects are also present in the deeper part of the layer corresponding to the end of range of ions. After annealing, the samples implanted at temperatures below 250°C present a polycrystalline structure with blisters at the surface while in the other samples coarsening of bubbles occurs and nanocavities are formed together with extended defects identified as ͕311͖ defects. The results are discussed in comparison to the case of helium-implanted silicon and in the light of radiation-enhanced diffusion.
Grazing incidence small-angle X-ray scattering experiments have been performed to study the morphology of nanocavities and {113} defects formed by implantation of 5 Â 10 16 cm À2 neon and helium ions in Si (001) at 50 keV. The results show that spherical cavities are formed in Si(001) implanted with Ne ions at 873 K and in Si(001) implanted with He ions at 473 K subsequently annealed at 873 K. In contrast, He-induced cavities at 873 K show {111} facets and wide size distribution due to an enhanced He mobility at high temperature. In addition to the faceted cavities, the clustering of interstitials leads to the formation of large extended planar {113} defects whose size has been estimated to be about 100 nm.
The interfaces of multilayered CVD diamond films grown by the hot-filament technique were characterized with high detail using HRTEM, STEM-EDX, and EELS. The results show that at the transition from micro- (MCD) to nanocrystalline diamond (NCD), a thin precursor graphitic film is formed, irrespectively of the NCD gas chemistry used (with or without argon). On the contrary, the transition of the NCD to MCD grade is free of carbon structures other than diamond, the result of a higher substrate temperature and more abundant atomic H in the gas chemistry. At those transitions WC nanoparticles could be found due to contamination from the filament, being also present at the first interface of the MCD layer with the silicon nitride substrate.
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