Anisotropic growth is observed for GaN(0001) during molecular beam epitaxy for both the stepflow growth mode and two-dimensional (2D) nucleation growth mode. Using scanning tunneling microscopy, we find that in the step-flow growth mode, growth anisotropy strongly influences the shape of terrace edges, making them strikingly different between hexagonal and cubic films. In the 2D nucleation growth mode, anisotropic growth results in triangularly shaped islands. The importance of understanding growth anisotropy to achieve better grown GaN films is discussed.

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Abstract-Despite significant advances in structure and material optimization, poor erase (E) speeds and high retention charge loss remain the challenging issues for charge trap Flash (CTF) memories. In this paper, the dependence of SANOS memory performance and reliability on the composition of silicon nitride (SiN) layer is extensively studied. The effect of varying the Si:N ratio on program (P)/E and retention characteristics is investigated. SiN composition is shown to significantly alter the electron and hole trap properties. Varying the SiN composition from N-rich (N + ) to Si-rich (Si + ) lowers electron trap depth but increases hole trap depth, causing lower P state saturation but significant overerase, resulting in an enhanced memory window. During retention, P state charge loss depends on thermal emission followed by the tunneling out of electrons mostly through tunnel dielectric, which becomes worse for Si + SiN. Erase state charge loss mainly depends on hole redistribution under the influence of internal electric fields, which improves with Si + SiN. This paper identifies several important performances versus reliability tradeoffs to be considered during the optimization of SiN layer composition. It also explores the option for CTF optimization through the engineering of SiN stoichiometry for multilevel cell NAND Flash applications.Index Terms-Charge trap Flash (CTF), program/erase (P/E) window, retention, SANOS, silicon nitride (SiN), SONOS.

Homoepitaxial, GaN films on both c-plane surfaces of bulk GaN crystals were examined using reflection high-energy electron diffraction (RHEED). Differences in the RHEED pattern, time development of the RHEED intensity, and surface reconstructions were observed. The substrate surfaces were prepared either by mechanical polishing [GaN(0001)A] or by chemo-mechanically polishing [GaN(0001̄)B]. Then films were grown by molecular beam epitaxy; Ga was provide by a Knudsen cell and nitrogen from NH3. On the B surface, the Ga rich reconstructions reported by Smith and co-workers [Phys. Rev. Lett. 79, 3934 (1997)] were observed. On the A surface, a (2×2) reconstruction was observed. Both reconstructions were much sharper than those seen on GaN films grown on sapphire. RHEED measurements of the specular intensity vs time showed that two different surface terminations could be maintained on the B surface, one of which is a stable, gallided surface, while the other is a nitrided surface, which is unstable in vacuum. If the nitrided surface is heated in vacuum it changes to the gallided surface in several minutes at 800 °C. Only one termination was detected on the A surface. The results are complemented by desorption mass spectroscopy measurements, and the resulting surfaces were then investigated using atomic force microscopy and scanning tunneling microscopy. We were able to distinguish the two surface terminations on the B surface, and a unique annealing process under NH3 will be documented. Preliminary investigation of the A surface revealed decorated step edges. The results were compared to films grown on sapphire with different nucleation layers, which can be grown to yield either polarity.

Abstract-Silicon-nitride trap layer stoichiometry in charge trap flash (CTF) memory strongly impacts electron and hole trap properties, memory performance, and reliability. Important tradeoffs between program/erase (P/E) levels (memory window), P-and E-state retention loss, and E-state window closure during cycling are shown. Increasing the Si richness of the SiN layer improves memory window, cycling endurance, and E-state retention loss but at the cost of higher P-state retention loss. The choice of SiN stoichiometry to optimize CTF memory performance and reliability is discussed.Index Terms-Charge trap flash (CTF), cycling endurance, program/erase (P/E) window, retention, SANOS, silicon nitride (SiN), SONOS.

The performance and reliability of Charge Trap Flash with single and bi-layer Si-rich and N-rich nitride as the storage node is studied. Single layer devices show lower memory window and poor cycling endurance, and the underlying physical mechanisms for these issues are explained. An engineered trap layer consisting of Si-rich and Nrich nitride interfaced by a SiON barrier layer is proposed. The effect of varying the SiON interfacial layer position on memory window and reliability is investigated. Optimum bi-layer device shows higher memory window and negligible degradation due to cycling (at higher memory window) compared to single layer films. The role of SiON interface in improving the performance and reliability of bi-layer stacks is explained.

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Abstract-Program/Erase (P/E) cycling endurance in poly-Si/Al 2 O 3 /SiN/SiO 2 /Si (SANOS) memories is systematically studied. Cycling-induced trap generation, memory window (MW) closure, and eventual stack breakdown are shown to be strongly influenced by the material composition of the silicon nitride (SiN) charge trap layer. P/E pulsewidth and amplitude, as well as starting program and erase flatband voltage (V FB ) levels (therefore the overall MW), are shown to uniquely impact stack degradation and breakdown. An electron-flux-driven anode hole generation model is proposed, and trap generation in both SiN and tunnel oxide are used to explain stack degradation and breakdown. This paper emphasizes the importance of SiN layer optimization for reliably sustaining large MW during P/E operation of SANOS memories.