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In this article, we propose a new drift velocity technique to measure electromigration at temperatures of 125 o C to directly assess electromigration transport at use conditions. We present measurements of the temperature of the drift velocity of Cu conductors with small and large polycrystalline grain size. A significant grain size dependence of drift velocity was found, indicating a large flux of atoms through grain boundaries when the fraction of polycrystalline segments is a significant fraction of the conductor length. A physical model is proposed to explain the drift velocity behavior in Cu nano-wires and we determine the diffusion parameters from grain boundary diffusion and interface diffusion.

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The fundamentals of droplet-based cleaning of photomasks are investigated and performance regimes that enable the use of binary spray technologies in advanced mask cleaning are identified. Using phase Doppler anemometry techniques, the effect of key performance parameters such as liquid and gas flow rates and temperature, nozzle design, and surface distance on droplet size, velocity, and distributions were studied. The data are correlated to particle removal efficiency (PRE) and feature damage results obtained on advanced photomasks for 193-nm immersion lithography.