No abstract

High-voltage operation of LiNi0.5Co0.2Mn0.3O2 positive electrodes is attained in highly concentrated LiBF4/DMC electrolyte solution because of the stabilized BF4− and DMC.

The liquid desiccant air-conditioning system allows reducing energy consumption compared to the conventional compressor-type air conditioners. In order to develop desiccant materials for air conditioners, we have investigated the dehumidification capability of quaternary ammonium Ionic Liquids (ILs) and the equilibrium water vapor pressure of aqueous solutions of these ammonium salts. Among the seven tested types of ILs, 2-hydroxy- N , N , N -trimethylethan-1-aminium dimethylphosphate ([Ch][DMPO 4 ]) displayed the best dehumidification capability and the lowest equilibrium water vapor pressure. Furthermore, the 80% aqueous solution of [Ch][DMPO 4 ] exhibited a less corrosive effect on four types of metals, i.e., steel (hot dip zinc-aluminum alloy plated steel), copper (C1100P), aluminum (A5052), and stainless steel (SUS: SUS304). It should be noted that this [Ch][DMPO 4 ] is not only non-toxic but also exhibits a stable nature; the aqueous solution produced no odor after storing for over 1 year under ambient conditions.

We have investigated metalmetal joining using "unusual wetting", in which a liquid metal spreads by capillary action on a porous metal surface layer formed under atmospheric oxidationreduction. Although oxidationreduction creates an adequate porous structure for "unusual wetting", it is difficult to subject only a specific area to atmospheric oxidationreduction treatment, and region-selective "unusual wetting" and joining are not achieved. In this work, we propose the use of laser, which is able to treat regions selectively, to form a suitable structure for "unusual wetting". A fine asperity structure was observed on the Cu substrate surface after laser treatment. This structure was termed a "surface fine crevice structure". The wettability of the laser-treated Cu substrate by liquid Bi was determined to confirm region-selective "unusual wetting" on the "surface fine crevice structure". We also joined two Cu substrates by "unusual wetting" after creating a "surface fine crevice structure".