In this paper, some recent piezoelectric wafer active sensors (PWAS) progress achieved in our laboratory for active materials and smart structures (LAMSS) at the University of South Carolina: http: //www.me.sc.edu/research/lamss/ group is presented. First, the characterization of the PWAS materials shows that no significant change in the microstructure after exposure to high temperature and nuclear radiation, and the PWAS transducer can be used in harsh environments for structural health monitoring (SHM) applications. Next, PWAS active sensing of various damage types in aluminum and composite structures are explored. PWAS transducers can successfully detect the simulated crack and corrosion damage in aluminum plates through the wavefield analysis, and the simulated delamination damage in composite plates through the damage imaging method. Finally, the novel use of PWAS transducers as acoustic emission (AE) sensors for in situ AE detection during fatigue crack growth is presented. The time of arrival of AE signals at multiple PWAS transducers confirms that the AE signals are originating from the crack, and that the amplitude decay due to geometric spreading is observed.

This paper presents a new methodology for detecting and quantifying delamination in composite plates based on the high-frequency local vibration under the excitation of piezoelectric wafer active sensors. Finite-element-method-based numerical simulations and experimental measurements were performed to quantify the size, shape, and depth of the delaminations. Two composite plates with purpose-built delaminations of different sizes and depths were analyzed. In the experiments, ultrasonic C-scan was applied to visualize the simulated delaminations. In this methodology, piezoelectric wafer active sensors were used for the high-frequency excitation with a linear sine wave chirp from 1 to 500 kHz and a scanning laser Doppler vibrometer was used to measure the local vibration response of the composite plates. The local defect resonance frequencies of delaminations were determined from scanning laser Doppler vibrometer measurements and the corresponding operational vibration shapes were measured and utilized to quantify the delaminations. Harmonic analysis of local finite element model at the local defect resonance frequencies demonstrated that the strong vibrations only occurred in the delamination region. It is shown that the effect of delamination depth on the detectability of the delamination was more significant than the size of the delamination. The experimental and finite element modeling results demonstrate a good capability for the assessment of delamination with different sizes and depths in composite structures.

The acoustic emission (AE) method is a very popular and well-developed method for passive structural health monitoring of metallic and composite structures. AE method has been efficiently used for damage source detection and damage characterization in a large variety of structures over the years, such as thin sheet metals. Piezoelectric wafer active sensors (PWASs) are lightweight and inexpensive transducers, which recently drew the attention of the AE research community for AE sensing. The focus of this paper is on understanding the fatigue crack growth AE signals in thin sheet metals recorded using PWAS sensors on the basis of the Lamb wave theory and using this understanding for predictive modeling of AE signals. After a brief introduction, the paper discusses the principles of sensing acoustic signals by using PWAS. The derivation of a closed-form expression for PWAS response due to a stress wave is presented. The transformations happening to the AE signal according to the instrumentations we used for the fatigue crack AE experiment is also discussed. It is followed by a summary of the in situ AE experiments performed for recording fatigue crack growth AE and the results. Then, we present an analytical model of fatigue crack growth AE and a comparison with experimental results. The fatigue crack growth AE source was modeled analytically using the dipole moment concept. By using the source modeling concept, the analytical predictive modeling and simulation of the AE were performed using normal mode expansion (NME). The simulation results showed good agreement with experimental results. A strong presence of nondispersive S0 Lamb wave mode due to the fatigue crack growth event was observed in the simulation and experiment. Finally, the analytical method was verified using the finite element method. The paper ends with a summary and conclusions; suggestions for further work are also presented.

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Acoustic waves are widely used in structural health monitoring (SHM) for detecting fatigue cracking. The strain energy released when a fatigue crack advances has the effect of exciting acoustic waves, which travel through the structures and are picked up by the sensors. Piezoelectric wafer active sensors (PWAS) can effectively sense acoustic waves due to fatigue-crack growth. Conventional acoustic-wave passive SHM, which relies on counting the number of acoustic events, cannot precisely estimate the crack length. In the present research, a novel method for estimating the crack length was proposed based on the high-frequency resonances excited in the crack by the energy released when a crack advances. In this method, a PWAS sensor was used to sense the acoustic wave signal and predict the length of the crack that generated the acoustic event. First, FEM analysis was undertaken of acoustic waves generated due to a fatigue-crack growth event on an aluminum-2024 plate. The FEM analysis was used to predict the wave propagation pattern and the acoustic signal received by the PWAS mounted at a distance of 25 mm from the crack. The analysis was carried out for crack lengths of 4 and 8 mm. The presence of the crack produced scattering of the waves generated at the crack tip; this phenomenon was observable in the wave propagation pattern and in the acoustic signals recorded at the PWAS. A study of the signal frequency spectrum revealed peaks and valleys in the spectrum that changed in frequency and amplitude as the crack length was changed from 4 to 8 mm. The number of peaks and valleys was observed to increase as the crack length increased. We suggest this peak–valley pattern in the signal frequency spectrum can be used to determine the crack length from the acoustic signal alone. An experimental investigation was performed to record the acoustic signals in crack lengths of 4 and 8 mm, and the results were found to match well with the FEM predictions.

Piezoelectric transducers are convenient enablers for generating and receiving Lamb waves for damage detection. Fatigue cracks are one of the most common causes for the failure of metallic structures. Increasing emphasis on the integrity of critical structures creates an urgent need to monitor structures and to detect cracks at an early stage to prevent catastrophic failures. This paper presents a two-dimensional (2D) cross-correlation imaging technique that can not only detect a fatigue crack but can also precisely image the fatigue cracks in metallic structures. The imaging method was based on the cross-correlation algorithm that uses incident waves and the crack-scattered waves of all directions to generate the crack image. Fatigue testing for crack generation was then conducted in both an aluminum plate and a stainless-steel plate. Piezoelectric wafer transducer was used to actuate the interrogating Lamb wave. To obtain the scattered waves as well as the incident waves, a scanning laser Doppler vibrometer was adopted for acquiring time-space multidimensional wavefield, followed with frequency-wavenumber processing. The proof-of-concept study was conducted in an aluminum plate with a hairline fatigue crack. A frequency-wavenumber filtering method was used to obtain the incident wave and the scattered wave wavefields for the cross-correlation imaging. After this, the imaging method was applied to evaluate cracks on a stainless-steel plate generated during fatigue loading tests. The presented imaging method showed successful inspection and quantification results of the crack and its growth.

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Barely visible impact damage (BVID) due to low velocity impact events in composite aircraft structures are becoming prevalent. BVID can have an adverse effect on the strength and safety of the structure. During aircraft inspections it can be extremely difficult to visually detect BVID. Moreover, it is also a challenge to ascertain if the BVID has in-fact caused internal damage to the structure or not. This paper describes a method to ascertain whether or not internal damage happened during the impact event by analyzing the high-frequency information contained in the recorded acoustic emission signal signature. Multiple 2 mm quasi-isotropic carbon fiber reinforced polymer (CFRP) composite coupons were impacted using the ASTM D7136 standard in a drop weight impact testing machine to determine the mass, height and energy parameters to obtain approximately 1” impact damage size in the coupons iteratively. For subsequent impact tests, four piezoelectric wafer active sensors (PWAS) were bonded at specific locations on each coupon to record the acoustic emission (AE) signals during the impact event using the MISTRAS micro-II digital AE system. Impact tests were conducted on these instrumented 2 mm coupons using previously calculated energies that would create either no damage or 1” impact damage in the coupons. The obtained AE waveforms and their frequency spectrums were analyzed to distinguish between different AE signatures. From the analysis of the recorded AE signals, it was verified if the structure had indeed been damaged due to the impact event or not. Using our proposed structural health monitoring technique, it could be possible to rapidly identify impact events that cause damage to the structure in real-time and distinguish them from impact events that do not cause damage to the structure. An invention disclosure describing our acoustic emission structural health monitoring technique has been filed and is in the process of becoming a provisional patent.