Transient Li‐ion batteries based on polymeric constituents are presented, exhibiting a twofold increase in the potential and approximately three orders of magnitude faster transiency rate compared to other transient systems reported in the literature. The battery takes advantage of a close variation of the active materials used in conventional Li‐ion batteries and can achieve and maintain a potential of >2.5 V. All materials are deposited form polymer‐based emulsions and the transiency is achieved through a hybrid approach of redispersion of insoluble, and dissolution of soluble components in approximately 30 min. The presented proof of concept has paramount potentials in military and hardware security applications. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016, 54, 2021–2027

unique attribute of transient electronics is that they are designed to operate over a typically short and predefined duration of time and disintegrate fully or partially when no longer needed.This concept can be applied to a number of different systems, including implantable biomedical devices, [1,2] environmental sensors, [3,4] and hardware security, [5,6] to name a few examples. Transient implantable biomedical devices could be designed to degrade within the body after a predefined period of reliable operation; this will eliminate the need for secondary surgery needed to extract the device. Transient environmental sensors made of environmentally friendly (green) and degradable polymers could be utilized to collect various types of data such as humidity and pressure, then be absorbed into the environment, minimizing bulk waste that is harmful to wildlife, such as birds and fish. And last, transient hardware-secured devices could undergo disintegration, making sensitive information irretrievable upon degradation.Research in transient electronics started with the integration of conventional electronic components on a degradable substrate and was followed by the integration of partially transient electronic components and a few fully degradable components. [7][8][9] The most recent form of transient electronics, however, is fully transient. [10][11][12][13][14] To date, researchers have successfully synthesized and designed material systems and transiency mechanisms that allow electronic devices with functionality and performance level of the conventional counterparts, and yet capable of undergoing disintegration once needed.This short review will report on the materials used in transient electronics, mechanisms that facilitate transiency, manufacturing techniques of this class of electronics, and transient electronic devices developed so far and their potential applications. Transient MaterialsStructural components of electronics, in general, consist of a substrate that acts as the mechanical support and electronic components that are responsible for the functionality of the system. In the case of transient electronics, all the constituents must be capable of dissolution or disintegration to facilitate

Transient electronics is a class of electronic devices designed to maintain stable operation for a desired and preset amount of time; and, undergo fast and complete degradation and deconstruction once transiency is triggered. Controlled and programmed transiency in solvent‐triggered devices is strongly dependent on chemical and physical interactions between the solvent and the device, as well as those within the device itself, among its constituent components. Mechanics of transiency of prototypical transient circuits demonstrate strong dependence of the transiency characteristics on that of the substrate. In the present study, we demonstrate the control of transiency through the dissolution behavior of a substrate for the devices with electronic parts composed of colloidal units. It is observed that the physical circuit–substrate interactions are the dominating factors in defining the overall transiency behavior of the device. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016, 54, 517–524

Transient soft bioelectronics are capable of forming conformal contacts with curvilinear surfaces of biological host tissues and organs. Such systems are often subject to continuous static and dynamic loads from the biological host. In this article, we present investigation of electronic attributes of transient soft bioelectronic circuits subjected to mechanical force and influence of substrate's transiency on the transiency of the whole device; also, characterize and quantify loss of functionality in triggered devices. Variations in the electrical conductivity of circuits as a function of applied mechanical load was used as a means to deduce electronic characteristics under stress. The experimental results suggest that there exists a correlation between electronic properties of circuits and applied mechanical strain; no clear correlation was, however, observed between electronic properties of circuits and frequency of the applied dynamic load. Control over transiency rate of identical circuits utilizing the transiency characteristics of the poly(vinyl alcohol)l-based substrates is also studied and demonstrated.

Thermoplastic resins (linear low-density polyethylene (LLDPE), high-density polyethylene (HDPE), and polypropylene (PP)) reinforced by different content ratios of raw agave fibers were prepared and characterized in terms of their mechanical, thermal, and chemical properties as well as their morphology. The morphological properties of agave fibers and films were characterized by scanning electron microscopy and the variations in chemical interactions between the filler and matrix materials were studied using Fourier-transform infrared spectroscopy. No significant chemical interaction between the filler and matrix was observed. Melting point and crystallinity of the composites were evaluated for the effect of agave fiber on thermal properties of the composites, and modulus and yield strength parameters were inspected for mechanical analysis. While addition of natural fillers did not affect the overall thermal properties of the composite materials, elastic modulus and yielding stress exhibited direct correlation to the filler content and increased as the fiber content was increased. The highest elastic moduli were achieved with 20 wt % agave fiber for all the three composites. The values were increased by 319.3%, 69.2%, and 57.2%, for LLDPE, HDPE, and PP, respectively. The optimum yield stresses were achieved with 20 wt % fiber for LLDPE increasing by 84.2% and with 30 wt % for both HDPE and PP, increasing by 52% and 12.3% respectively.