The large-scale patterning of materials and molecules down to nanometer feature sizes is a critical issue of nanoscience and nanotechnology. Photolithography is limited by the wavelength of light, which is 193 nm for the deep-UV technology used today in industry, while extreme-UV technology under development can reach 50 nm feature sizes, aiming for 32 nm in 2009.[1] These limitations have motivated an extensive exploration of alternative lithographies based on self-assembly. Soft lithography is a versatile approach for the replication of patterns into a broad variety of media, [2] but the original pattern, as in photolithography, has usually to be generated by other methods. Nanopattern generation systems (NPGSs) include electron-beam lithography [3] and scanning-probe nanolithographies, such as dip-pen nanolithography [4] and constructive nanolithography, [5] which can reach feature sizes down to 5, 30, and 9 nm, respectively. These methods have the advantage that the pattern is encoded in a computer-assisted design software file, allowing the deterministic generation of arbitrary, aperiodic patterns, as well as periodic patterns with high degrees of perfection and long-range order. A major disadvantage of these top-down nanopattern generation methods, however, is that they are serial, and hence extremely time consuming for large areas. A recent nanofabrication method based on the replication of superlattice cross sections yields sub-10 nm periodic nanowires of high perfection, [6] but the width of the patterned area is limited to a few hundred micrometers by the thickness of the templating superlattice. Bottom-up nanopattern generation processes based on spontaneous self-assembly, are parallel, and thus of special technological as well as scientific interest, especially for large-area, periodic nanostructures where perfection and long-range order are less critical. This may be the case for nanoelectronics, where connectivity and short-range order are more important than long-range order, and there can be a certain degree of defect tolerance, [7] as well as for many other applications in surface and materials technology, such as display and microarray technology, micro-electromechanics, chem/bio sensing, and so forth.