Data are presented on high-power AlGaInN flip-chip light-emitting diodes (FCLEDs). The FCLED is “flipped-over” or inverted compared to conventional AlGaInN light-emitting diodes (LEDs), and light is extracted through the transparent sapphire substrate. This avoids light absorption from the semitransparent metal contact in conventional epitaxial-up designs. The power FCLED has a large emitting area (∼0.70 mm2) and an optimized contacting scheme allowing high current (200–1000 mA, J∼30–143 A/cm2) operation with low forward voltages (∼2.8 V at 200 mA), and therefore higher power conversion (“wall-plug”) efficiencies. The improved extraction efficiency of the FCLED provides 1.6 times more light compared to top-emitting power LEDs and ten times more light than conventional small-area (∼0.07 mm2) LEDs. FCLEDs in the blue wavelength regime (∼435 nm peak) exhibit ∼21% external quantum efficiency and ∼20% wall-plug efficiency at 200 mA and with record light output powers of 400 mW at 1.0 A.
The effect of Si doping on the strain and microstructure in GaN films grown on sapphire by metalorganic chemical vapor deposition was investigated. Strain was measured quantitatively by x-ray diffraction, Raman spectroscopy, and wafer curvature techniques. It was found that for a Si concentration of 2ϫ10 19 cm Ϫ3 , the threshold for crack formation during film growth was 2.0 m. Transmission electron microscopy and micro-Raman observations showed that cracking proceeds without plastic deformation ͑i.e., dislocation motion͒, and occurs catastrophically along the low energy ͕11 គ00͖ cleavage plane of GaN. First-principles calculations were used to show that the substitution of Si for Ga in the lattice causes only negligible changes in the lattice constant. The cracking is attributed to tensile stress in the film present at the growth temperature. The increase in tensile stress caused by Si doping is discussed in terms of a crystallite coalescence model.
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