No abstract

Auger recombination is determined to be the limiting factor for quantum efficiency for InGaN–GaN (0001) light-emitting diodes (LEDs) at high current density. High-power double-heterostructure (DH) LEDs are grown by metal-organic chemical vapor deposition. By increasing the active layer thickness, DH LEDs can reach a maximum in quantum efficiency at current densities above 200A∕cm2. Encapsulated thin-film flip-chip DH LEDs with peak wavelength of 432nm have an external quantum efficiency of 40% and output power of 2.3W at 2A.

The electronic properties of Si donors in heteroepitaxial layers of GaN were investigated. The n-type GaN layers were grown by metalorganic chemical vapor deposition and either intentionally doped with Si or unintentionally doped. The samples were evaluated by variable temperature Hall effect measurements and photoluminescence (PL) spectroscopy. For both types of samples the n-type conductivity was found to be dominated by a donor with an activation energy between 12 and 17 meV. This donor is attributed to Si atoms substituting for Ga in the GaN lattice (SiGa). The range of activation energies is due to different levels of donor concentrations and acceptor compensation in our samples. The assignment of a PL signature to a donor–acceptor pair recombination involving the Si donor level as the initial state of the radiative transition yields the position of the optical Si donor level in the GaN bandgap at ∼Ec–(22±4) meV. A deeper donor level is also present in our GaN material with an activation energy of ∼34 meV which is tentatively assigned to oxygen donors substituting for nitrogen (ON).

The activation kinetics of acceptors was investigated for heteroepitaxial layers of GaN, doped with Mg. After growth, the samples were exposed to isochronal rapid thermal anneals in the temperature range from 500 to 775 °C. The samples were studied by variable temperature Hall effect measurements and photoluminescence (PL) spectroscopy in the as-grown condition and after each temperature step. The thermal treatment reduced the resistivity by six orders of magnitude and the p-type conductivity was found to be dominated by an acceptor with an activation energy of ∼170 meV. This acceptor is attributed to Mg atoms substituting for Ga in the GaN lattice and the activation process is consistent with dissociation of electrically inactive Mg–H complexes. It is shown that the appearance of a blue emission band in the PL spectrum of Mg-doped GaN does not directly correlate with the increase in p-type conductivity.

GaN samples, containing various concentrations of carbon and doped intentionally with silicon, have been grown heteroepitaxially on sapphire using metal–organic chemical-vapor deposition. These samples have been characterized by a variety of electrical and optical techniques, and the resulting experimental data are compared to density-functional-theory calculations of the formation energies and electronic states of substitutional and interstitial carbon in hexagonal GaN. We find that in samples where the silicon concentration exceeds that of carbon, carbon sits in the N substitutional site, acting as an acceptor and partially compensating the material. However, when carbon densities exceed those for Si, GaN becomes semi-insulating due to carbon occupation of both N and Ga substitutional lattice sites, and a new luminescence peak appears at ∼3 eV. Calculated formation energies of carbon in both sites are strong functions of both the Fermi level and growth stoichiometry. The former dependence gives rise to self-compensation when [C]>[Si] because the formation energy of the Ga substitutional configuration (the donor state) becomes equal to that of the N substitutional site, effectively pinning the Fermi level as it approaches midgap. Our results suggest that effective p-type doping of GaN can only be achieved under Ga-rich growth conditions.

Data are presented on high-power AlGaInN flip-chip light-emitting diodes (FCLEDs). The FCLED is “flipped-over” or inverted compared to conventional AlGaInN light-emitting diodes (LEDs), and light is extracted through the transparent sapphire substrate. This avoids light absorption from the semitransparent metal contact in conventional epitaxial-up designs. The power FCLED has a large emitting area (∼0.70 mm2) and an optimized contacting scheme allowing high current (200–1000 mA, J∼30–143 A/cm2) operation with low forward voltages (∼2.8 V at 200 mA), and therefore higher power conversion (“wall-plug”) efficiencies. The improved extraction efficiency of the FCLED provides 1.6 times more light compared to top-emitting power LEDs and ten times more light than conventional small-area (∼0.07 mm2) LEDs. FCLEDs in the blue wavelength regime (∼435 nm peak) exhibit ∼21% external quantum efficiency and ∼20% wall-plug efficiency at 200 mA and with record light output powers of 400 mW at 1.0 A.

The spatial dependence of the luminescence intensities at the band edge (364 nm) and at the ‘‘yellow’’ defect-band (centered at 560 nm) regions for epitaxial GaN films have been studied using cathodoluminescence microscopy at room temperature. The films were grown by metalorganic chemical vapor deposition on (0001) sapphire substrates and were not intentionally doped. Significant nonuniformities in the band-to-band and in the yellow band emissions were observed. Yellow luminescence in small crystallites appears to originate from extended defects inside the grains and at low-angle grain boundaries. The size of band-to-band emission sites correlates with low-angle grain sizes observed by transmission electron microscopy.

The effect of Si doping on the strain and microstructure in GaN films grown on sapphire by metalorganic chemical vapor deposition was investigated. Strain was measured quantitatively by x-ray diffraction, Raman spectroscopy, and wafer curvature techniques. It was found that for a Si concentration of 2ϫ10 19 cm Ϫ3 , the threshold for crack formation during film growth was 2.0 m. Transmission electron microscopy and micro-Raman observations showed that cracking proceeds without plastic deformation ͑i.e., dislocation motion͒, and occurs catastrophically along the low energy ͕11 គ00͖ cleavage plane of GaN. First-principles calculations were used to show that the substitution of Si for Ga in the lattice causes only negligible changes in the lattice constant. The cracking is attributed to tensile stress in the film present at the growth temperature. The increase in tensile stress caused by Si doping is discussed in terms of a crystallite coalescence model.