We propose a low-temperature nickel silicidation with a dopant segregation approach to form shallow anode profiles in thin wafer insulated-gate bipolar transistors (IGBTs). The process provides an anode with a boron peak concentration of 3 × 10 19 /cm 3 after annealing at 400°C. The silicidation results in a NiSi phase with a strong interface roughness, independent of the polishing process after grinding. The devices exhibit characteristics comparable with the state-of-the-art IGBTs in terms of voltage drop (V CE,ON ), which indicates that a higher anode activation was achieved at low temperature in comparison with the reference samples, since the anode is <27% of its initial thickness. Devices that underwent chemical mechanical planarization exhibit higher V CE,ON than those without, possibly due the increase of surface roughness.
A new soft-punch-through (SPT) buffer concept for 600-1200 V insulated-gate bipolar transistors (IGBTs) based on thin wafer technology is proposed. The new SPT structure employs an epitaxial layer for the lightly doped n-type drift region, which is grown on a thick starting material or substrate. The n-type substrate serves as the SPT buffer region. The doping concentration of both drift and buffer regions are comparably low with the buffer region having a higher doping level. The design options of this new concept are discussed based on experimental data and 1200 V IGBTs using the new buffer concept are compared to IGBTs employing previously published buffer technology.
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