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In present research, walnut like copper sulfide is prepared via a facile single‐step potentiostatic electrodeposition method on conducting stainless steel substrate. The walnut like morphology of copper sulfide thin film lies of microplates and further microplates converted to nanogranuals, by means of a change in deposition time and thickness. Copper sulfide thin film electrode reveals a specific capacitance of 132 F g−1 at 50 mA cm−2. The film thickness changes with deposition time. The films acquire maximum thickness of 610 nm for 25 min of deposition. X‐ray diffraction analysis revels that the CuS thin films is polycrystalline in nature and the crystallite size is 29 nm. The peak at 612 cm−1 in the Fourier transform infrared spectroscopy spectra confirms the formation of CuS. The wettability study shows the hydrophilic nature, the contact angle of water with CuS electrode is 66°, and the charge transfer resistance of CuS electrode is 7.78 Ω.

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