To investigate the performance of bonding on the interface between ZChSnSb/Sn and steel body, the interfacial bonding energy on the interface of a ZChSnSb/Sn alloy layer and the steel body with or without Sn as an intermediate layer was calculated under the same loadcase using the molecular dynamics simulation software Materials Studio by ACCELRYS, and the interfacial bonding energy under different Babbitt thicknesses was compared. The results show that the bonding energy of the interface with Sn as an intermediate layer is 10% larger than that of the interface without a Sn layer. The interfacial bonding performances of Babbitt and the steel body with Sn as an intermediate layer are better than those of an interface without a Sn layer. When the thickness of the Babbitt layer of bushing is 17.143 Å, the interfacial bonding energy reaches the maximum, and the interfacial bonding performance is optimum. These findings illustrate the bonding mechanism of the interfacial structure from the molecular level so as to ensure the good bonding properties of the interface, which provides a reference for the improvement of the bush manufacturing process from the microscopic point of view.
:In order to investigate the bonding properties of the interface of laminated metal composites, a new type of composite structure bushing babbitt alloy ZChSnSb8-4 is studied based on the modelling characteristics of atomic substitution method. Considering the proportion of three components of Cu 6 Sn 5 , SnSb, Sn in babbitt alloy, the interfacial bonding properties of multilayer alloy composite bushing are simulated and studied using molecular dynamics method. The results show that the minimum interfacial bonding energy of five-layer structure bushing is 33.87% higher than that of three-layer structure bushing, so the interfacial bonding performance of five-layer structure bushing is better than that of three-layer structure bushing. Meanwhile, according to the bonding energy of the adjacent two interfaces of different structure bushing, it is found that the dangerous bonding interface may be caused by different composite layer bushing. The interfacial bonding energy betweensteel-lead alloy layer andnickel gate layer is the largest and the bond is the strongest, and the interface bonding energy between nickel gate layer and babbitt alloy layer is the least, and the phenomenon of alloy falling off is the most likely. A new type of compound structure bushing is studied from the molecular level, and the bonding mechanism of the interfaces provides a reference for the production practice.
The experimental analysis of ignition responses of mildly impacted Ammonium Perchorate (AP) particles was performed based on an optimized drop‐weight system equipped with a High‐Speed Camera (HSC). The experimental results suggested that the jetting phenomena observed by HSC is the result of the energy released by gaseous products, which push the pulverized or melted particles to splash radially. In the process of complex stress stimulation, AP particles experienced four stages of compaction, solid phase transition, sputtering, and ignition. In addition, with the increase in temperature, AP particle sensitivity increased. At room temperature, AP particles are insensitive particles. When the temperature is 50 °C, the ignition threshold of AP particles is 40 cm. However, when the temperature increases to 100 °C, the ignition threshold is 35 cm. Finally, particle friction and rapid gas compression are the main reasons for the ignition of AP particles during impact loading.
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