It is well known that in modern micro- and nanoelectronics thin-film structures are actively used as a gate dielectric, passivating layers, membranes, etc. The research is devoted to the problem of crack formation in thin sublayers of silicon oxide during pulsed heating of interconnects on single-crystal silicon wafers. The purpose of the paper is to study the effect of surface sources of thermal shock on the cracks formation in films and aspects of crack formation in SO2 films have been studied in detail. Experimental verification of the estimates made was carried out on multilayer structures of a silicon substrate-silicon oxide sublayer-aluminum film (Si-SiO2-Al). As substrates, it was used phosphorus-doped silicon single-crystal wafers oriented in the (111) direction, with a resistivity in the range p = 0.1 Ω.сm. The authors studied the temperature fields in silicon wafers (Al-Si system) and silicon oxide wafers (Al-SiO2 system) heated by a surface metallization layer both for the case of a point heat source and for the case of a long rectangular metallization path (provided that the track length significantly exceeds its width). The calculation results showed that the temperature profile of the metallization path (width 75 μm) in the transverse direction is heterogeneous. It was also shown that, in contrast to SiO2 films, the level of appearing mechanical stresses in silicon is insufficient for the formation of cracks near the source of thermal shock. This is due to a higher tensile strength than that of oxide.
The paper is devoted to the study of the nonlinearity of the output signal of the pressure sensor on the silicon on sapphire structure (SOS). The authors constructed a mathematical model of the strain-gauge and carried out numerical simulation by using the ANSYS 12.1 software. For comparative analysis, the problem was solved both in a geometrically nonlinear and in a geometrically linear formulation. To account for the elastic-plastic properties of the silver solder PSR72, the Prandtl diagram was used. As a result, the maximum stresses and deformations in the sapphire crystal, solder, and titanium membrane under which the design successfully works were determined, and also the nonlinearity of the output signal was estimated in depending of the applied pressure. According to calculations, the nonlinearity of the output signal is 11.3%. The received value is unacceptable for this type of sensor, and requires further tuning, which negatively affects the accuracy of the product and its cost.
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