ECPR (ElectroChemical Pattern Replication) is a newfabrication process for the production of microstructures in conducting materials. Using ECPR, the cost of metallization for advanced packaging solutions can be significantly reduced compared to using lithography based processes. The technology utilizes a reusable master electrode for electrochemical pattern replication, which enables direct metallization with short cycle times, high throughput and comparbly low equipment investments.ECPR provides metallization on most s'ubstrates such as silicon wafers, ceramic substrates and flexible or rigid organic substrates. The technique currently enables pattern transfer of copper structures down to 515 pm linehpace with uniform material distribution and high resolution patterns with small line width variations. Results from replication studies on both ultrathin polyimide substrates and silicon wafers are presented.
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