ECPR (electrochemical pattern replication): metal printing for advanced packaging applications

Abstract

ECPR (ElectroChemical Pattern Replication) is a newfabrication process for the production of microstructures in conducting materials. Using ECPR, the cost of metallization for advanced packaging solutions can be significantly reduced compared to using lithography based processes. The technology utilizes a reusable master electrode for electrochemical pattern replication, which enables direct metallization with short cycle times, high throughput and comparbly low equipment investments.ECPR provides metallization on most s'ubstrates such as silicon wafers, ceramic substrates and flexible or rigid organic substrates. The technique currently enables pattern transfer of copper structures down to 515 pm linehpace with uniform material distribution and high resolution patterns with small line width variations. Results from replication studies on both ultrathin polyimide substrates and silicon wafers are presented.

Recent Progress in the Development of ECPR (ElectroChemical Pattern Replication)Metal Printing for Microelectronics

“…By eliminating all steps of polymer processing related to lithography, the recently introduced Electrochemical Pattern Replication (ECPR) technique offers a simplified process sequence and significant cost and cycle time savings compared to traditional metallization. [1,2] In the ECPR process, a template (master electrode), comprising an electrically conducting electrode layer and one or several patterned layers of electrically insulating materials, is put in contact with a substrate in the presence of an electrolyte which is applied between the two surfaces. When put in contact, excessive electrolyte is forced away and local electrochemical micro-cells, filled with electrolyte, are formed by the cavities between the surfaces according to the pattern of the master electrode.…”