The paper considers technological solutions for the production of multi-chip package-on-package assemblies. To evaluate the capabilities of the manufacturer product line the PoP prototype samples were produced. The results of qualification tests of PoP prototype samples are presented. Conclusions have been drawn on the applicability of systems in package, combining the installation technologies of Wire Bond and Flip-Chip crystals.
The paper presents the results of the development of a package-on-package multichip microcircuit with three-dimensional integration of processor and memory dies. The stages of fabrication the upper part of the microcircuit with several memory dies, which are mounted by the wire bonding method, and the lower part of the microcircuit, on which the processor die is attached by the flip-chip method, are described. After the fabrication of the microcircuit by combining the upper and lower substrates, a multi-stage functional testing of the processor and memory dies is performed using a test board and software loaded into the microcircuit memory.
The paper presents the concept of a modular hardware platform for the development of IoT devices using the example of a system for collecting and analyzing information. Design variants of modules that implement the basic functions of IoT devices are presented: obtaining primary data and their preliminary processing, data aggregation and transmission, data analysis and storage of results. The technologies of multi-chip packaging and three-dimensional integration are presented, which can significantly reduce the size of the developed modules.
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