It is known that epoxy molding compounds have a significant impact on productivity, service life and reliability of electronic microcircuit components. Wrong choice of a molding mixture can lead to mechanical stresses, deformation, cracking or lamination of the protective packaging followed by microcircuit breakage. The study summarizes information on composition, main operating characteristics and application methods of epoxy molding compounds as well as their impact on microcircuit shape distortion. Main methods for control of physical and mechanical properties of epoxy molding compounds with the most significant impact on microcircuit hermetic sealing and on formation of different kinds of defects in the protective packing.
The paper considers technological solutions for the production of multi-chip package-on-package assemblies. To evaluate the capabilities of the manufacturer product line the PoP prototype samples were produced. The results of qualification tests of PoP prototype samples are presented. Conclusions have been drawn on the applicability of systems in package, combining the installation technologies of Wire Bond and Flip-Chip crystals.
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