Diffusion in silicon of elements from columns III and V of the Periodic Table is reviewed in theory and experiment. The emphasis is on the interactions of these substitutional dopants with point defects {vacancies and interstitials) as part of their diffusion mechanisms. The goal of this paper is to unify available experimental observations within the framework of a set of physical models that can be utilized in computer simulations to predict diffusion processes in silicon. The authors assess the present state of experimental data for basic parameters such as point-defect diffusivities and equilibrium concentrations and address a number of questions regarding the mechanisms of dopant diffusion. They offer illustrative examples of ways that diffusion may be modeled in one and two dimensions by solving continuity equations for point defects and dopants. Outstanding questions and inadequacies in existing formulations are identified by comparing computer simulations with experimental results. A summary of the progress made in this field in recent years and of directions future research may take is presented.

&DIGITAL-MICROFLUIDIC LAB-ON-A-CHIP (LoC) technology offers a platform for developing diagnostic applications with the advantages of portability, sample and reagent volume reduction, faster analysis, increased automation, low power consumption, compatibility with mass manufacturing, and high throughput. In addition to diagnostics, digital microfluidics is finding use in airborne chemical detection, DNA sequencing by synthesis, and tissue engineering. In this article, we review efforts to develop various LoC applications using electrowetting-based digital microfluidics. We describe these applications, their implementation, and associated design issues. The ''Related work'' sidebar gives a brief overview of microfluidics technology.

We have demonstrated symmetrically high levels of electrical activation of both p- and n-type dopants in germanium. Rapid thermal annealing of various commonly implanted dopant species were performed in the temperature range of 600–850 °C in germanium substrates. Diffusion studies were also carried out by using different anneal times and temperatures. T-SUPREM™ simulations were used to fit the experimental profiles and to extract the diffusion coefficient of various dopants.

The integrated circuit (IC) industry has followed a steady path of shrinking device geometries for more than 30 years. It is widely believed that this process will continue for at least another ten years. However, there are increasingly difficult materials and technology problems to be solved over the next decade if this is to actually occur and, beyond ten years, there is great uncertainty about the ability to continue scaling metal-oxide-semiconductor field-effect transistor (MOSFET) structures. This paper describes some of the most challenging materials and process issues to be faced in the future and, where possible solutions are known, describes these potential solutions. The paper is written with the underlying assumption that the basic metal-oxide-semiconductor (MOS) transistor will remain the dominant switching device used in ICs and it further assumes that silicon will remain the dominant substrate material.

Bipolar resistive switching was found in thin polycrystalline TiO2 films formed by the thermal oxidation of sputtered Ti films. With a Ag top electrode, TiO2 film, and Pt bottom electrode, bistable resistive switching with a low operating voltage and a good uniformity was observed repeatedly without an initial electrical “forming” process. This switching phenomenon might be described as the formation and rupture of a filamentary conductive path consisting of a chain of Ag atoms. The temperature dependence of the switching voltage is discussed in terms of interstitial ionic diffusion of Ag in the TiO2 matrix.