In this study optical properties of InGaN/GaN/Al 2 O 3 multi-quantum well (MQW) structures are investigated in detail. Three samples containing InGaN/GaN/Al 2 O 3 MQWs are grown by using metal organic chemical vapor deposition technique. Sapphire (6H-Al 2 O 3 ) is used as the substrate. Forbidden energy band gaps (E g ) of these three samples are determined from photoluminescence and absorption spectra. Results gained from these two spectra are compared with each other. It is found that E g values are between 2 and 3 eV. For determining refraction index, absorption coefficients, extinction coefficients and thickness of the films a rare method called Swanepoel envelope method is used. It is seen that results gained from this method are consistent with those in literature.
In this study, InGaN/GaN structure is investigated in the temperature range of 300-500 °C with steps of 50 °C. InGaN/ GaN multi-quantum well structure is deposited on c-orientated sapphire wafer by metal organic chemical vapour deposition method. All the parameters except for temperature kept constant during growth period. InGaN/GaN structures with different In content are investigated by XRD technique. Their structural, optical and morphological characteristics are determined by high resolution X-ray diffraction, Fourier transform spectroscopy (FTIR), photo luminescence (PL), transmission and atomic force microscopy (AFM). According to FTIR and PL spectra's, it is noticed that band gap values coincide with blue region in the electromagnetic spectrum. As a result of transmission measurements it is seen that light is completely absorbed by the sample at approximately 390 nm. Using XRD technique, dislocation densities and strain are calculated. Full width at half maximum of the XRD peak values gained from X-ray diffraction are used in an alternative method called Williamson-Hall (W-H). Using W-H method, lateral and vertical crystal lengths and tilt angles are determined. Surface roughness parameters are investigated by AFM. Different properties of GaN and InGaN layers are compared as dependent on increasing temperature. According to AFM images it is seen that these structures have high surface roughness and large crystal size. All the results yielded from the mentioned methods are in good agreement with the previous works done by different authors.
In this study, three InGaN/GaN light-emitting diode (LED) structures with five periods are investigated grown by metal organic chemical vapor deposition (MOCVD) technique. During growth of these three samples, active layer growth temperatures are adjusted as 650, 667 and 700 °C. These structures are grown on sapphire (Al 2 O 3 ) wafer as InGaN/GaN multiquantum wells (MQWs) between n-GaN and p-AlGaN + GaN contact layers. During growth, pressure and flux ratio of all sources are kept constant for all samples. Only temperature of InGaN active layer is changed. These structures are analyzed with high-resolution X-ray diffraction (HR-XRD) technique. Their surface morphologies are investigated with atomic force microscopy (AFM). Reciprocal space mapping (RSM) is made different from classical HR-XRD analyses. Using this method, mixed peaks belonging to InGaN, AlGaN and GaN layers are seen more clearly and their full width at half maximum (FWHM) values is determined with better accuracy. With FWHM gained from RSM and Williamson-Hall (W-H) method based on universal elastic coefficients of the material, particle size D (nm), uniform stress σ (GPa), strain ε and anisotropic energy density u (kJ m −3 ) parameters for the samples are calculated. The results are compared with literature. On the other hand, to have an idea about the accuracy of the results AFM images are examined. Parameters calculated showed differences but it is seen that the largest particle size is gained for GaN and the smallest is gained for AlGaN. For all parameters, it is seen that they increase for GaN layer and decrease for AlGaN layer with increasing temperature. For InGaN layer parameters, they showed both increasing and decreasing or decreasing and increasing behavior harmonically with an increase in temperature. Results showed that they are compatible with literature. Results gained from Scherrer and W-H are very near to each other.
By using metal organic chemical vapor deposition technique, InGaN/GaN solar cell (SC) structure is deposited over sapphire (Al 2 O 3) wafer as GaN buffer and GaN epitaxial layers. Structural properties of InGaN/GaN/Al 2 O 3 SC structure is investigated by using high resolution X-ray diffraction technique dependent on In content. By using reciprocal space mapping, reciprocal space data are converted to w-θ data with a software. These w-θ data and full width at half maximum data are used for calculating lattice parameters. When compared with w-θ measurements in literature it is seen that especially a-lattice parameter is found very near to universal value from RSM. It is calculated as 3.2650 nm for sample A (S.A) GaN layer and 3.2570 nm for sample B (S.B) GaN layer on (105) asymmetric plane. Strain and stress calculations are made by using these lattice parameters. Strain and stress are calculated as 0.02363 and 8.6051 GPa for S.A GaN layer respectively. Other results are given in tables in the results and discussion section of this article. Edge, screw and mixed type dislocations are calculated as mosaic defects. All these calculations are made for two samples on (002) symmetric and (105) asymmetric planes. As a result it is seen that measurements by using RSM give more sensitive results. a-lattice parameter calculated with this technique is the best indicator of this result.
In this study, AlInN/AlN high electron mobility transistor (HEMT) structure is grown on c-oriented sapphire substrate using metal organic chemical vapor deposition method. Optical properties of the structure are investigated by photoluminescence (PL) and ultraviolet (UV-Vis.) spectras. According to PL results, direct bandgap of AlN is determined around 2.80 eV. In UV-Vis. spectra it is seen that conduction of AlInN layer starts at 360 nm. Swanepoel envelope method is applied on transmission spectra and some optical properties such as refractive index (n), film thickness (t), absorption coefficient (α), and extinction coefficient (k) are determined. Forbidden energy bandgap is determined again from Tau method and it is compared with the value gained from PL spectra. This study is a rare one that presents optical properties of HEMTs using Swanepoel and Tau methods. In addition to this, it helps estimating how optical properties of HEMTs effect electrical properties.
In this study, InGaN/GaN structures are grown by using Metal Organic Chemical Vapor Deposition (MOCVD) technique. Some structural, optical and morphological properties of InGaN/GaN structures are investigated in detail. For structural analysis, X-ray diffraction (XRD), for optical, Raman and morphological, Atomic Force Microscopy (AFM) measurement techniques are used. In XRD analysis both samples presented hexagonal crystal structure. XRD peaks for these two samples showed small differences dependent on growth conditions. Strain and stress values are determined from XRD and they are compared with Raman results. In Raman analysis, five different chemicals are determined in both samples. Raman analysis results are in good accordance with XRD, growth conditions and AFM images. In AFM images, there can be seen hills and holes and they are partly homogeneous. There are also some white regions in AFM images. According to Raman peak center data, these white regions are detected as white rust.
Bu makaleye şu şekilde atıfta bulunabilirsiniz(To cite to this article): Akpinar O., Bilgili A.K., Ozturk M.K. Ozcelik S., and Ozbay E., "Investigation of structural, optical and electrical properties of Al0.3Ga0.7N/GaN HEMT grown by MOCVD", Politeknik Dergisi,, 23(3): 687-696, (2020).Erişim linki (To link to this article): http://dergipark.org.tr/politeknik/archive Comparison of the structural features of the structure grown with MOCVD with the literature Suitability of mobility and carrier density values of HEMT structure Optical results give similar results compared to previous studies Graphical AbstractIn this study, the magnification phase of Al0.3Ga0.7N / GaN HEMT structure and structural, optical and electrical properties after magnification were investigated. Figure A. 2-Intensity plot for Al0.3Ga0.7N/GaN HEMT structure on symmetric planes Aim Comparison of the conformity of this structure with the literature, which was enlarged by the MOCVD method. Design & MethodologyWhile building the structure, HEMT structure was created by MOCVD method. OriginalityIt is a completely original work. These studies have not been done with the same material before. FindingsThe results I obtained after structural, optical and electrical measurements were observed to be compatible with the literature. ConclusionIn this study AlGaN/GaN HEMT structure is grown by MOCVD method. Optic, morphological and electric characterization of the samples are made with XRD, PL, UV-Vis, AFM and Hall-resistant measurements. 2θ, FWHM, lattice parameters, particle size, strain, stress and dislocation calculations are made on 19 different planes. Surface roughness of the sample is determined by morphological characterization. Hall-resistant measurements of the sample are made after taking the contacts by Van der Pauw method at 0.4 T constant magnetic field. In optical characterization according to PL measurement results 383 nm wavelength corresponds to 3.24 eV. This value is in fact the direct band gap of GaN. In UV-Vis the conduction of AlGaN layer started at 360 nm that corresponds to 3.48 eV. In morphological characterization low RMS showed that the sample has good surface quality. It is noticed that carrier density is not effected by the temperature and mobility is high. It is assumed that the slight increase on carrier density at high temperature is caused by the annealing effect. On the other hand, as the temperature decrease mobility increase. ÖZBu çalışmada c-eksenli safir alttaş üzerine MOCVD yöntemiyle büyütülen Al0.3Ga0.7N/GaN yüksek elektron hareketli transistör (HEMT) yapısı incelenmiştir. Bu yapının optik, morfolojik ve elektriksel özellikleri X-Işını Kırınımı (XRD), Fotoluminesans (PL), Ultraviyole ve görünür ışık (UV-Vis), Atomik Kuvvet Mikroskobu (AFM) ve Hall-Direnç ölçümleri ile belirlendi. Simetrik ve asimetrik düzlemlerde XRD metodu ile 2θ, Yarım Maximum'daki Tam Genişlik (FWHM), örgü parametreleri, kristal boyutu, zorlama, gerilme ve dislokasyon değerleri hesaplanmıştır. GaN'nin doğrudan bant aralığı PL ölçümleriyle...
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