Holographic interferometry with three illumination directions can be applied to detennine all components ofa displacement vector wihtout previous knowledge of the main deformation direction. Combined with a microscopic arrangement this method is utilized for the investigation of the operating parameters of sensor micro-components. The interferometer is adapted to the microscopic demands by conjugate reconstruction. Matching holographic and microscopic requirements is the fimdamental assumption for correct operation of the holographic microscope. By the application of all advantages of conjugate reconstruction the holographic microscope has been optimized in optical and numerical parameters for the evaluation of all components of the deformation vector. Phase shifting and carrier fringe techniques have been applied for interferogram evaluation according to the object shape and deformation behavior. When absolute values ofthe deformation were already determined, electrooptic holography can be used for routine measurements because of its time savings. The method was used for the calibration of cantilevers for micromechanical sensors, the determination of the deformatious of a circular micromembrane, and a solder joint in a microelectronic printed circuit board. The influence of different object orientation on the measurement resuls was investigated additionally.
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