Some investigations in holographic microscopic interferometry with respect to the estimation of stress and strain in micro-opto-electro-mechanical systems (MOEMS)

Characterization of the static and dynamic behaviour of M(O)EMS by optical techniques: status and trends

“…The result is then visualized by illuminating the developed hologram with the reference beam (reconstruction phase) [11]. Although this method was occasionally used in the MEMS field (see, for example, [64]), digital holography (DH) and electronic speckle pattern interferometry (ESPI) (figure 6) are much more convenient because they allow an acquisition at video rate with a CCD array. In both cases, measurements at two different wavelengths λ 1 and λ 2 must be performed for surface contouring with a sensitivity related to the synthetic wavelength λ s = λ 1 λ 2 /(λ 1 − λ 2 ) [65][66][67][68].…”

Optical fiber interferometer for measuring the <bold>in situ </bold> deflection characteristics of microelectromechanical structures

“…These approaches may be scanned to yield linear or two-dimensional displacement data. 16 Full-field optical measurement techniques have been applied to MEMS structures, and they include holographic interferometry, 17,18 moiré interferometry 18 and stroboscopic interferometry. 19 In contrast with sensing systems applied strictly for the development of MEMS devices, some sensor systems are integrated as part of the overall system architecture.…”