This paper presents the thermal performance of a proposed thermal management device (patented in 2009) intended for a thermophoretic based soot sensor. The performance was studied for temperatures ranging from 50°C to 400°C and for exhaust speeds up to 10m/s. It also presents the design and basic concepts. The performance study and design development was performed with finite element analysis (FEA). The FEA results were then verified with experiments in a heated wind tunnel. The relative performance of the device was found to increase for higher temperatures and lower wind speeds. The main conclusion drawn from this study was that it is feasible to cool a sensor surface enough for a thermophoretic based soot sensor in a diesel exhaust system.
Abstract-This paper presents the thermal performance of a proposed thermal management device (patented in 2009) intended for a thermophoresis-based soot sensor. The performance was studied for temperatures ranging from 50°C to 400°C and for exhaust speeds up to 10m/s. It also presents the design and basic concepts. The performance study and design development was performed with finite element analysis (FEA). The FEA results were then verified with experiments in a heated wind tunnel. The relative performance of the device was found to increase for higher temperatures and lower wind speeds. The main conclusion drawn from this study was that it is feasible to cool a sensor surface enough for a thermophoresis-based soot sensor in a diesel exhaust system.
Novel and emerging packaging technologies expand the designer's toolbox. Metal coated polymer spheres (MPS) for ball grid array (BGA) assembly is a promising interconnect technology improving reliability, while high thermal conductivity substrates, e.g. AlSiC and AlN, is interesting for enhanced thermal performance. But new tools bring along new challenges in the design phase of innovative packaging solutions. Knowledge of how these tools influence the system characteristics is therefore key; e.g. electrical, mechanical and thermal performance.This study reports on the thermal performance of several novel and more traditional interconnect and substrate technologies. It comprises a relative thermal impact study of individual technologies. The system consists of a power dissipating silicon die assembled onto different substrates with varying interconnect technologies. The study was performed with finite element analysis (FEA) assisted with a compact model and is scheduled for comparison with identical fabricated systems.The results show that it is possible to utilize FEA efficiently on a system scale during the design process with sufficient accuracy. It also reveals that the combination of interconnect and substrate technology should be chosen with care, especially regarding the system's thermal performance, disclosing potential reliability issues and illustrating costbenefit tradeoffs. KEY WORDS: Thermal management, metal coated polymer spheres, anisotropic conductive film, ceramic and metal matrix substrates, FEA, simulation NOMENCLATURE cross-sectional area, m 2 heat transfer coefficient, W/m 2 ·K total radiosity, W/m 2 thermal conductivity, W/m·K characteristic length, m heat transfer rate, W ′′ heat flux, W/m 2 resistance, K/W thickness, m temperature, K width/length, m impedance, K·cm 2 /W Greek symbols emissivity ∆ difference gradient Stefan-Boltzmann constant, W/m 2 ·K 4
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