Performance of a thermal management system for thermophoresis based soot sensors — Design, performance and verification

Larsson, Andréas; Storstrom, O.; Seip, Torleif Andre Tollefsen; Hjelstuen, M.; Johansson, Mats L.; Fägerman, Per-Erik; Björklund, Robert B.; Spetz, Anita Lloyd; Grant, Ann W.; Jozsa, Peter; Paaso, Jaska; Hammarlund, L

doi:10.1109/icsens.2010.5690860

Cited by 1 publication

(4 citation statements)

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“…2 Extracted from matweb.com 3 The literature provides a wide span of numbers ranging from 20 to 90 W/m·K for substrates [28]. Most commonly they are in the range 20-40 W/m·K and matweb.com states 35 W/mK.…”

Section: Pcb -Flexiblementioning

confidence: 99%

“…4 Calculated according to equation (10) [15] 250 1 [15] 50 [15] BGA -MPS Cu/Polymer/SAC 260 [20] 130 1 [20] 385/0.2 4 [23], [15] 1 Bump/ball diameter. 3 Thermal conductivity of stud bump (Au) and ACF (polymer) respectively. 2 Bump radius and die width respectively.…”

Section: Pcb -Flexiblementioning

confidence: 99%

“…Industries like Oil & Gas, process, automotive, aero and aerospace request high performance electronics systems that may be introduced ever closer to challenging regions, e.g. inside turbine engines [2], exhaust systems [3] and downhole exploration tools [4] [5]. Sensors and electronics must be able to operate reliably at high temperatures for long time periods.…”

Section: Introductionmentioning

confidence: 99%

“…Fabricated test samples for correlation measurements 3. Thermal conductivity measurements were performed by Tyndall.…”

mentioning

confidence: 99%

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Interconnects and substrates for thermal considerations

Larsson

Vardoy

Oldervoll

et al. 2012

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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Novel and emerging packaging technologies expand the designer's toolbox. Metal coated polymer spheres (MPS) for ball grid array (BGA) assembly is a promising interconnect technology improving reliability, while high thermal conductivity substrates, e.g. AlSiC and AlN, is interesting for enhanced thermal performance. But new tools bring along new challenges in the design phase of innovative packaging solutions. Knowledge of how these tools influence the system characteristics is therefore key; e.g. electrical, mechanical and thermal performance.This study reports on the thermal performance of several novel and more traditional interconnect and substrate technologies. It comprises a relative thermal impact study of individual technologies. The system consists of a power dissipating silicon die assembled onto different substrates with varying interconnect technologies. The study was performed with finite element analysis (FEA) assisted with a compact model and is scheduled for comparison with identical fabricated systems.The results show that it is possible to utilize FEA efficiently on a system scale during the design process with sufficient accuracy. It also reveals that the combination of interconnect and substrate technology should be chosen with care, especially regarding the system's thermal performance, disclosing potential reliability issues and illustrating costbenefit tradeoffs. KEY WORDS: Thermal management, metal coated polymer spheres, anisotropic conductive film, ceramic and metal matrix substrates, FEA, simulation NOMENCLATURE cross-sectional area, m 2 heat transfer coefficient, W/m 2 ·K total radiosity, W/m 2 thermal conductivity, W/m·K characteristic length, m heat transfer rate, W ′′ heat flux, W/m 2 resistance, K/W thickness, m temperature, K width/length, m impedance, K·cm 2 /W Greek symbols emissivity ∆ difference gradient Stefan-Boltzmann constant, W/m 2 ·K 4

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Section: Pcb -Flexiblementioning

confidence: 99%