We propose a concept of transparent electrode for solar cells surpassing conventional transparent conductive oxide. Transparent electrode requires low electrical resistivity, high optical transparency, and high optical haze. Although transparent conductive oxide by chemical vapor deposition is widely used as a transparent electrode for solar cells, a breakthrough of the trade-off between electrical and optical properties is required for further improvement of solar cell efficiency. We demonstrate solution-processed electrode fabrication by using nanoimprint technology and metal nanoparticle ink. Silver mesh electrode is self-aligned on nanoimprinted texture with concave pattern as a template for mesh grid. Our electrode concept can realize desired high optical haze by nanoimprinted texture, as well as low electrical resistivity and high optical transparency by metal mesh electrode simultaneously, which boosts solar cell efficiency.
Self-aligned multiple patterning technique has enabled the further down scaling through 193 immersion lithography extension [1][2][3][4][5]. In particular, focus on the logic device scaling, we have finished the verification of patterning technology of up to 10nm node [6-7], we will discuss about some patterning technologies that are required to 7nm node. For critical layers in FinFET devices that presume a 1D cell design, there is also a need not just for the scaling of grating patterns but also for pattern cutting process. In 7nm node, cutting number increase in metal or fin layer, and also pattern splitting of contact or via is complicated, so both cost reduction and process controllability including EPE are strongly required. For example, inverse hardmask scheme in metal layer can improve CD variation of the Cu wiring. Furthermore hole pattern shrink technology in contact layer, by the combination with the exposure technique which has k1 0.25 or less, can achieve both cost reduction and reducing the numbers of pitch splitting. This paper presents the possibility of immersion-based multiple patterning techniques for up to 7nm node.
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