The issues on the replacement of high Pb solder for high power module application has been a major concern among researchers since Pb could caused toxicity to the environment. Alternatively, transient liquid phase (TLP) has becomes a potential bonding technology for high power module devices. Typical TLP bonding for solder is a bonding method that using an interlayer of low and high temperature metal. However, a new transient liquid phase bonding which dealing with solder in the form of powder and paste has been developed. Both bonding methods have successfully increased the melting temperature of the bonded alloys higher than the bonding temperature as will be discussed further.
The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead-free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperature solder. This paper provides a short review of recent research on Zn-Sn based lead free high temperature solders with different additional alloying elements. The new novel alloy of Zn-Sn based for high temperature solder applications will be proposed in this paper.
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