Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste

Said, Rita Mohd; Salleh, Mohd Arif Anuar Mohd; Saud, Norainiza; Ramli, Mohd Izrul Izwan; Yasuda, Hideyuki; Nogita, Kazuhiro

doi:10.1007/s10854-020-03657-4

Cited by 9 publications

(4 citation statements)

References 37 publications

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“…Besides that, there are also a number of interfacial voids as in Figures 6-8. The formation of interfacial voids was caused by flux outgassing during soldering [37,42]. It can be seen in Figure 6c-f that there is one primary Cu 6 Sn 5 IMC (denoted with 'g') nucleated at the exact locations during the third to the sixth cycle of reflow soldering.…”

Section: In Situ Observation On Primary Cu 6 Sn 5 Imc During Multiple...mentioning

confidence: 99%

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

et al. 2022

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Solder interconnection in three-dimensional (3D) electronic packaging is required to undergo multiple reflow cycles of the soldering process. This paper elucidates the effects of multiple reflow cycles on the solder joints of Sn-3.0Ag-0.5Cu (SAC305) lead (Pb)-free solder with the addition of 1.0 wt.% kaolin geopolymer ceramics (KGC). The samples were fabricated using powder metallurgy with the hybrid microwave sintering method. Apart from using conventional cross-sectioned microstructure imaging, advanced synchrotron real-time in situ imaging was used to observe primary IMC formation in SAC305-KGC solder joints subjected to multiple reflow soldering. The addition of KGC particles in SAC305 suppressed the Cu6Sn5 IMC’s growth as primary and interfacial layers, improving the shear strength after multiple reflow soldering. The growth rate constant for the interfacial Cu6Sn5 IMC was also calculated in this study. The average growth rate of the primary Cu6Sn5 IMCs decreased from 49 µm/s in SAC305 to 38 µm/s with the addition of KGC particles. As a result, the average solidified length in the SAC305-KGC is shorter than SAC305 for multiple reflow soldering. It was also observed that with KGC additions, the growth direction of the primary Cu6Sn5 IMC in SAC305 changed from one growth to two growth directions. The observed results can be attributed to the presence of KGC particles both at grains of interfacial Cu6Sn5 IMCs and at the surface of primary Cu6Sn5 IMC.

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Section: In Situ Observation On Primary Cu 6 Sn 5 Imc During Multiple...mentioning

confidence: 99%

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

et al. 2022

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“…Thus, it was concluded that if the fracture happens at the bulk region, it is ductile [ 19 ]. Moreover, if the fracture occurs in the region near the solder and intermetallic interface, it is a mixture of brittle and ductile fractures [ 20 ].…”

Section: Resultsmentioning

confidence: 99%

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing

et al. 2021

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This manuscript reports the isothermal annealing effect on the mechanical and microstructure characteristics of Sn-0.7Cu-1.5Bi solder joints. A detailed microstructure observation was carried out, including measuring the activation energy of the intermetallic compound (IMC) layer of the solder joints. Additionally, the synchrotron µX-ray fluorescence (XRF) method was adopted to precisely explore the elemental distribution in the joints. Results indicated that the Cu6Sn5 and Cu3Sn intermetallic layers thickness at the solder/Cu interface rises with annealing time at a rate of 0.042 µm/h for Sn-0.7Cu and 0.037 µm/h for Sn-0.7Cu-1.5Bi. The IMC growth’s activation energy during annealing is 48.96 kJ mol-1 for Sn-0.7Cu, while adding Bi into Sn-0.7Cu solder increased the activation energy to 55.76 kJ mol−1. The µ-XRF shows a lower Cu concentration level in Sn-0.7Cu-1.5Bi, where the Bi element was well dispersed in the β-Sn area as a result of the solid solution mechanism. The shape of the IMC layer also reconstructs from a scallop shape to a planar shape after the annealing process. The Sn-0.7Cu hardness and shear strength increased significantly with 1.5 wt.% Bi addition in reflowed and after isothermal annealing conditions.

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“…Cu-Sn and Ag -Sn IMCs were also observed [3]. Recently, various TLPS metallic couples have been proposed [6][7][8][9][10][11], but among those systems, Cu-Sn-Ag [12,13] and Cu-Sn [14][15][16][17] are the most popular solders. These solder structures can ensure good thermal conductivity and high mechanical strength [12][13][14][15][16][17].…”

Section: Introductionmentioning

confidence: 99%

“…Recently, various TLPS metallic couples have been proposed [6][7][8][9][10][11], but among those systems, Cu-Sn-Ag [12,13] and Cu-Sn [14][15][16][17] are the most popular solders. These solder structures can ensure good thermal conductivity and high mechanical strength [12][13][14][15][16][17]. However, the reliability issues related to the void formation and brittle nature of such solders are still in need of consideration.…”

Section: Introductionmentioning

confidence: 99%

Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints

Tran,

Liu,

Chen

2024

Materials

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The effects of the sintering duration and powder fraction (Ag-coated Cu/SnAgCu) on the microstructure and reliability of transient liquid phase sintered (TLPS) joints are investigated. The results show that two main intermetallic compounds (IMCs, Cu6Sn5 and Cu3Sn) formed in the joints. The Cu6Sn5 ratio generally decreased with increasing sintering time, Cu powder fraction, and thermal treatment. The void ratio of the high-Cu-fraction joints decreased and increased with increasing sintering and thermal stressing durations, respectively, whereas the low-Cu-fraction counterparts were stable. We also found that the shear strength increased with increasing thermal treatment time, which resulted from the transformation of Cu6Sn5 and Cu3Sn. Such findings could provide valuable information for optimizing the TLPS process and assuring the high reliability of electronic devices.

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Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste

Cited by 9 publications

References 37 publications

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing

Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints

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