Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

Abstract

Solder interconnection in three-dimensional (3D) electronic packaging is required to undergo multiple reflow cycles of the soldering process. This paper elucidates the effects of multiple reflow cycles on the solder joints of Sn-3.0Ag-0.5Cu (SAC305) lead (Pb)-free solder with the addition of 1.0 wt.% kaolin geopolymer ceramics (KGC). The samples were fabricated using powder metallurgy with the hybrid microwave sintering method. Apart from using conventional cross-sectioned microstructure imaging, advanced synchrotron real-time in situ imaging was used to observe primary IMC formation in SAC305-KGC solder joints subjected to multiple reflow soldering. The addition of KGC particles in SAC305 suppressed the Cu6Sn5 IMC’s growth as primary and interfacial layers, improving the shear strength after multiple reflow soldering. The growth rate constant for the interfacial Cu6Sn5 IMC was also calculated in this study. The average growth rate of the primary Cu6Sn5 IMCs decreased from 49 µm/s in SAC305 to 38 µm/s with the addition of KGC particles. As a result, the average solidified length in the SAC305-KGC is shorter than SAC305 for multiple reflow soldering. It was also observed that with KGC additions, the growth direction of the primary Cu6Sn5 IMC in SAC305 changed from one growth to two growth directions. The observed results can be attributed to the presence of KGC particles both at grains of interfacial Cu6Sn5 IMCs and at the surface of primary Cu6Sn5 IMC.

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

“…Based on the images, i can be surmised that the Sn-0.7Cu solder alloy has a ductile fracture mode, per the circl shape seen in the figure. The dimples are also evident in the Sn-0.7Cu solder, confirming the material's ductile mode [46]. It can also be confirmed that there is no significant dif ference in the fracture behaviour of the solder joint.…”

Effects of Initial Morphology on Growth Kinetics of Cu6Sn5 at SAC305/Cu Interface during Isothermal Aging

“…Atomic interdiffusion occurs when Sn-based alloy is brought into contact with Cu, giving rise to the formation of intermetallic compounds (IMCs) such as Cu 6 Sn 5 and Cu 3 Sn at the contact interface [ 12 , 13 , 14 , 15 , 16 , 17 ]. The cooling conditions after the liquid/solid reaction had a significant effect on the thickness and morphology of IMCs [ 18 , 19 , 20 ].…”