The effect of different laser loop parameter on the geometry of micro-groove pattern on copper substrate and its effect on the wettability was investigated. The micro-grooves pattern was fabricated on the copper surface through laser surface texturing process. 3D measuring laser microscope and contact angle measurement test was conducted to measure the geometry of the micro-grooves pattern and wettability of the solder joint respectively. The results showed that the improvement in laser loop parameter increased the depth of the micro-grooves due to the more exposed time which allows more material ablation. It also showed that the contact angle of textured substrate is smaller than the untextured substrate which results in better wettability.
This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.
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